2016 17th International Conference on Electronic Packaging Technology (ICEPT) 2016
DOI: 10.1109/icept.2016.7583126
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Electromigration simulation of Cu pillar interconnect microstructure of 3D packaging

Zhiyuan Leng
1
,
Ming Xiao
2
,
Min He
3
et al.
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Cited by 3 publications
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References 13 publications
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Research on Electromigration Behavior of Cu Pillar Bumps under Pulse Current Stress

Xu
1
,
Lu
2
,
Fu
3
et al. 2021
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
1
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Research on Electromigration Behavior of Cu Pillar Bumps under Pulse Current Stress

Xu
1
,
Lu
2
,
Fu
3
et al. 2021
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
1
0
1
0
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Thermal-Electric-Mechanical coupling simulation of Cu Pillar Bumps under AC current

Li
1
,
Fu
2
,
Chen
3
et al. 2020
2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)
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Post-CMOS Fabrication Technology Enabling Simultaneous Fabrication of 3-D Solenoidal Micro-Inductors and Flexible I/Os

Zia
1
,
Oh
2
,
Bakir
3
2018
IEEE Trans. Compon., Packag. Manufact. Technol.
3
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2
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