“…Composed of physically energetic charged particles and chemically reactive neutral particles, plasma has been widely used in various fields including material fabrication and nuclear fusion as well as medical, environmental, and aerospace industries [ 1 , 2 ]. Plasma processing techniques such as plasma etching [ 3 , 4 , 5 , 6 , 7 ], ashing [ 8 , 9 , 10 , 11 ], and deposition [ 12 , 13 , 14 , 15 , 16 ] are the most important steps to fabricate the high-end memory and system semiconductors used in internet of things and artificial intelligence technologies. For plasma deposition in particular, plasma sputtering, plasma-enhanced chemical vapor deposition (PECVD), and plasma-enhanced atomic layer deposition (PEALD) approaches have been widely used for their high deposition rates, low-temperature processing, good film conformality, and high film uniformity [ 12 , 13 , 17 , 18 ].…”