2015
DOI: 10.1088/0963-0252/24/2/024001
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Electron heating and control of electron energy distribution for the enhancement of the plasma ashing processing

Abstract: Control of the electron energy distribution function (EEDF) is investigated through applying an inductive field in oxygen capacitively coupled plasma (CCP). With the addition of a small amount of antenna coil power to the CCP, low energy electrons are effectively heated and the EEDF is controlled. This method is applied to the ashing process of the photoresistor (PR). It is revealed that the ashing rate of the PR is significantly increased due to O radicals produced by the controlled EEDF, even though the ion … Show more

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Cited by 17 publications
(7 citation statements)
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“…The evolution in T e is interesting because it was well known that T e will either remain constant or slightly decrease with n e in the single-step or multi-step ionization global model. 1, 16 One possible explanation for this trend in T e may be the dramatic evolution of the EEPF through the electron heating effect 11,21,[30][31][32][33][34][35][36][37] or electronelectron collisions. 17,26,38,39 However, our experiment was conducted in plasmas having nearly Maxwellian EEPFs.…”
mentioning
confidence: 99%
“…The evolution in T e is interesting because it was well known that T e will either remain constant or slightly decrease with n e in the single-step or multi-step ionization global model. 1, 16 One possible explanation for this trend in T e may be the dramatic evolution of the EEPF through the electron heating effect 11,21,[30][31][32][33][34][35][36][37] or electronelectron collisions. 17,26,38,39 However, our experiment was conducted in plasmas having nearly Maxwellian EEPFs.…”
mentioning
confidence: 99%
“…[1][2][3][4][5] Plasma technology is also becoming more important for biomedical applications such as sterilization and wound healing. [6][7][8] For many of these applications capacitively coupled radio frequency (CCRF) discharges or hybrid combinations of CCRF plasmas with high density remote sources represent the most important reactor types, [9][10][11] since such plasmas allow for an efficient processing of dielectric substrates based on high fluxes of ions and chemically reactive radicals. In particular, the mean ion energy at the electrodes, which is crucially important for the plasma surface interaction, can be controlled in this type of plasmas.…”
mentioning
confidence: 99%
“…Composed of physically energetic charged particles and chemically reactive neutral particles, plasma has been widely used in various fields including material fabrication and nuclear fusion as well as medical, environmental, and aerospace industries [ 1 , 2 ]. Plasma processing techniques such as plasma etching [ 3 , 4 , 5 , 6 , 7 ], ashing [ 8 , 9 , 10 , 11 ], and deposition [ 12 , 13 , 14 , 15 , 16 ] are the most important steps to fabricate the high-end memory and system semiconductors used in internet of things and artificial intelligence technologies. For plasma deposition in particular, plasma sputtering, plasma-enhanced chemical vapor deposition (PECVD), and plasma-enhanced atomic layer deposition (PEALD) approaches have been widely used for their high deposition rates, low-temperature processing, good film conformality, and high film uniformity [ 12 , 13 , 17 , 18 ].…”
Section: Introductionmentioning
confidence: 99%