Electronic Packaging Materials for Extreme, Low Temperature, Fatigue Environments

Shapiro, Andrew A.; Tudryn, Carissa D.; Schatzel, Donald; Tseng, Stephen P.

doi:10.1109/tadvp.2010.2044504

Cited by 14 publications

(4 citation statements)

References 7 publications

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“…The staking material, however, did not seem to contribute to the nano-connector failure mechanism, which was a combination of a low fatigue life from brittle intermetallics and the brittle nature of tin at low temperature [4,12,15].…”

Section: ) Experiments Twomentioning

confidence: 92%

“…The monitoring and data recording for electrical continuity was a continuous scan during the temperature cycling. Details of the selection process and assembly testing and analysis, including the design of the test vehicles, test set-up and continuous monitoring, detailed test results, wire bond modeling, failure analysis with SEM cross-section images, and some materials combination suggestions can be found in the references [3][4][12][13][14][15]. This paper is focused on the qualification process for the technology development with the summary of the results.…”

Section: B Assembly Boardmentioning

confidence: 99%

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A motor drive electronics assembly for Mars Curiosity Rover: An example of assembly qualification for extreme environments

Kolawa

Chen

Mojarradi

et al. 2013

2013 IEEE International Reliability Physics Symposium (IRPS)

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-This paper describes the technology development and infusion of a motor drive electronics assembly for Mars Curiosity Rover under space extreme environments. The technology evaluation and qualification as well as space qualification of the assembly are detailed and summarized. Because of the uncertainty of the technologies operating under the extreme space environments and that a high level reliability was required for this assembly application, both component and assembly board level qualifications were performed.

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Section: ) Experiments Twomentioning

confidence: 92%

Section: B Assembly Boardmentioning

confidence: 99%

A motor drive electronics assembly for Mars Curiosity Rover: An example of assembly qualification for extreme environments

Kolawa

Chen

Mojarradi

et al. 2013

2013 IEEE International Reliability Physics Symposium (IRPS)

View full text Add to dashboard Cite

show abstract

“…The harsher the environmental conditions will be, the quicker the failures are expected to appear [13,14]. ALT approach involves a batch of a few components undergoing stresses exceeding the level of in-service operations and enables identification of extrinsic (voids, cracks, and delaminations) as well as intrinsic (electronic disorder, lattice defects, and grain boundaries) failure mechanisms.…”

Section: Experimental Conditionsmentioning

confidence: 99%

RFID tags for cryogenic applications: Experimental and numerical analysis of thermo-mechanical behaviour

Cauchois

Yin

Gouantes

et al. 2013

Microelectronics Reliability

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Abstract:RFID solutions will improve the traceability of biological samples stored at low temperature (77K) in biobanks. To achieve this goal, the reliability of RFID tags is essential. In this paper, we focus on the reliability aspect of RFID tags in harsh environment and more specifically to assembly design optimization through numerical simulations and accelerated life tests. A packagedimensioned model and a wire-interconnect centered model have been used to assess stress distribution in the package and wire bonds. We also develop a specific versatile test bench to apply thermal cycling while monitoring the functionality of the tags. We investigate 3 different tag configurations and demonstrate that the main failure mode is related to wire breaks. The occurrence of this failure depends mainly on the nature and thickness of the encapsulant resin which induce compressive and tensile stresses during thermal cycling. FEM results are in good agreement with observed failures.

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“…With the rapid development of microelectronics, microelectronic devices with variable thermal loads have been extensively used in the thermal energy system [1][2][3], chemical production [4][5][6], biomedical detection [7][8][9], deep space exploration fields [10][11][12], and in microelectromechanical systems (MEMS) [13][14][15][16]. The flip chip technology is widely applied in MEMS, in which solder joints are used as both mechanical supports and interconnections between electronic components [17,18].…”

Section: Introductionmentioning

confidence: 99%

Thermal Fatigue Modelling and Simulation of Flip Chip Component Solder Joints under Cyclic Thermal Loading

Han

Shao

et al. 2019

Energies

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Thermal Fatigue of flip chip component solder joints is widely existing in thermal energy systems, which imposes a great challenge to operational safety. In order to investigate the influential factors, this paper develops a model to analyze thermal fatigue, based on the Darveaux energy method. Under cyclic thermal loading, a theoretical heat transfer and thermal stress model is developed for the flip chip components and the thermal fatigue lives of flip chip component solder joints are analyzed. The model based simulation results show the effects of environmental and power parameters on thermal fatigue life. It is indicated that under cyclic thermal loading, the solder joint with the shortest life in a package of flip chip components is located at the outer corner point of the array. Increment in either power density or ambient temperature or the decrease in either power conversion time or ambient pressure will result in short thermal fatigue lives of the key solder joints in the flip chip components. In addition, thermal fatigue life is more sensitive to power density and ambient temperature than to power conversion time and ambient air pressure.

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Electronic Packaging Materials for Extreme, Low Temperature, Fatigue Environments

Cited by 14 publications

References 7 publications

A motor drive electronics assembly for Mars Curiosity Rover: An example of assembly qualification for extreme environments

A motor drive electronics assembly for Mars Curiosity Rover: An example of assembly qualification for extreme environments

RFID tags for cryogenic applications: Experimental and numerical analysis of thermo-mechanical behaviour

Thermal Fatigue Modelling and Simulation of Flip Chip Component Solder Joints under Cyclic Thermal Loading

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