2014
DOI: 10.1149/2.007406jes
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Electroplating of Fe-Rich NiFe Alloys in Sub-50 nm Lines

Abstract: The electroplating of NiFe alloys into 40 nm wide lines was studied using a variety of organic additives, including the ones used in literatures. In additive-free electrolytes, the presence of Fe was found to improve the super conformal plating into the trenches but defect free filling was not achieved. Potential transients during galvanostatic plating on rotating disk electrodes was used to characterize the additives. While some of the additives behave either as a suppressor or an accelerator, others showed b… Show more

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Cited by 16 publications
(16 citation statements)
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“…The high CE of MBIS is in accordance with that reported by Lee 12 and Liang. 15 Reasons behind might be attributed to the protonation of its charged group 16 and the variation of interface pH value, 17 etc.…”
Section: Resultsmentioning
confidence: 99%
“…The high CE of MBIS is in accordance with that reported by Lee 12 and Liang. 15 Reasons behind might be attributed to the protonation of its charged group 16 and the variation of interface pH value, 17 etc.…”
Section: Resultsmentioning
confidence: 99%
“…3,4,[18][19][20][21][22] Although Ni-Fe alloys can be prepared using various techniques such as sputtering and ball milling, electrodeposition may be the most feasible for low-cost mass production. The electrodeposition of Ni-Fe alloys from aqueous baths, therefore, have been widely studied, 3,4,[18][19][20][21][22] 20 can be easily prepared using electrodeposition. The electroplating baths of Ni-Fe alloys are composed of simple salts with or without complexing agents.…”
mentioning
confidence: 99%
“…3,5,7 To address these copper damascene extendibility issues, alternative metals, such as cobalt, are being actively explored for use in interconnects. [7][8][9][10][11][12][13][14][15][16][17][18] In terms of bulk resistivity, copper is significantly superior to cobalt. However, cobalt has a much shorter mean free path than copper, so it is expected to have superior scalability of resistivity to smaller line dimensions due to reduced scattering at material interfaces and grain boundaries.…”
mentioning
confidence: 99%