Embedding technologies for an automotive radar system

The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing with potential for low cost applications. Wafer level embedding technologies and embedding of active components into printed circuit boards CChip-in-Polymer) are two major packaging trends in this area. This paper describes the use of compression and transfer molding techniques for multi chip embedding in combination with large area and low cost redistribution technology from printed circuit board manufacturing as adapted for Chip-in-Polymer applications. The work presented is part of the German governmental funded project SmartSense. Embedding by transfer molding is a well known process for component embedding that is widely used for high reliable microelectronics encapsulation. However, due to material flow restrictions transfer molding does not allow large area encapsulation, but offers a cost effecti ve technology for embedding on a medium size scale as known e.g. from MAP Cmolded array packaging) molding Ctypically with sizes up to 60×60 mm2). In contrast, compression molding is a relatively new technology that has been especially developed for large area embedding of single chips but also of multiple chips or heterogeneous systems on wafer scale, typically up to 8" or even up to 12". Wiring of these embedded components is done using PCB manufacturing technologies, i.e. a resin coated copper CRCC) film is laminated over the embedded components - no matter which shape the embedded components areas are: a compression molded wafer, larger rectangular areas or smaller transfer molded systems CMAP). Typical process flow for RCC redistribution is lamination of RCC, via drilling to die pads by laser, galvanic Cu via filling, conductor line and pad formation by Cu etching, soldermask and solderable surface finish application - all of them standard PCB processes. The feasibility of the technology is de

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Sensor integrated microfluidics for compact micro-reactors

Jung

Blechert

Schuldt

et al. 2013

2013 IEEE 63rd Electronic Components and Technology Conference

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Novel approaches in cell based and cell free micro reactors promise a new generation of high quality, high purity and on top personalized synthesis of drugs like antibiotics and functional proteins. These concepts are - however-relying on very specific conditions, under which the cells need to work and therefore require advanced sensing for e.g. ionic content, pH value and temperature. Also, the creation of product itself needs to be monitored to extract the valuable drug from the reactor, before side reactions start to deteriorate quality and yield. Microfluidics has come a long way since, resulting in advanced Point of Care devices nowadays, which can run complex protocols/1/. However, these reactions are time based and the process conditions are fixed and not monitored at all. To leverage the capability to drug production, monitoring sensors need to be integrated into the fluidic system, creating a complex electronic-optical microfluidic device. Exemplary techniques for the integration of sensors are provided in this paper, technological approaches and experimental results are given

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Embedding technologies for an automotive radar system

Cited by 5 publications

References 3 publications

B5.1 - Radar Based Detection and Tracking of Objects under Poor Visibility Conditions

B5.1 - Radar Based Detection and Tracking of Objects under Poor Visibility Conditions

Large area embedding for heterogeneous system integration

Sensor integrated microfluidics for compact micro-reactors

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