Proceedings of the 5th Electronics System-Integration Technology Conference (ESTC) 2014
DOI: 10.1109/estc.2014.6962795
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Enabling technologies for system-level simulation of MEMS

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Cited by 8 publications
(10 citation statements)
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“…The thermal diffusivity of heavily doped LPCVD polysilicon films was reported to be 17 mm 2 /s by Mastrangelo and Muller [ 22 ], while single crystal silicon was reported as 82–95 mm 2 /s [ 5 ]. According to many other reports [ 23 , 24 , 25 , 26 , 27 ], heavily doped polysilicon has a thermal diffusivity ranging from 21.43 mm 2 /s to 36.56 mm 2 /s. Thermal characteristics can vary significantly from small differences in processes and geometrical settings.…”
Section: Experiments and Resultsmentioning
confidence: 99%
“…The thermal diffusivity of heavily doped LPCVD polysilicon films was reported to be 17 mm 2 /s by Mastrangelo and Muller [ 22 ], while single crystal silicon was reported as 82–95 mm 2 /s [ 5 ]. According to many other reports [ 23 , 24 , 25 , 26 , 27 ], heavily doped polysilicon has a thermal diffusivity ranging from 21.43 mm 2 /s to 36.56 mm 2 /s. Thermal characteristics can vary significantly from small differences in processes and geometrical settings.…”
Section: Experiments and Resultsmentioning
confidence: 99%
“…The stability problem introduced by pull-in effect is a rather complicated problem, and it should be discussed with regard to different states [ 39 , 40 , 41 ].…”
Section: System Description and Topology Analysismentioning
confidence: 99%
“…Our system is the modulated voltage case, in which the pull-in trigger point should be calculated from the accumulation effect of a series bits [ 43 ]. The dynamic pull-in is hard to be modeled, due to its strong nonlinear characteristics and because of the multiple solutions of the system state [ 39 , 44 , 45 ]. The modeling of the sensing element and stability analysis technique for multistate nonlinear systems need to be further researched, which is outside the scope of this paper.…”
Section: System Description and Topology Analysismentioning
confidence: 99%
“…insertion, isolation and reflection loss (Rebeiz, 2003; Jaafar et al , 2014). These devices, used in many MEMS, involve complex phenomena that make the models obtained from field analysis be too large to be included in system level simulations (Bechtold et al , 2013). That is why model order reduction strategies are needed, so that a discrete model with a reduced complexity is obtained (Schilders et al , 2008).…”
Section: Introductionmentioning
confidence: 99%