Encapsulated Organic Package Technology for Wideband Integration of Heterogeneous MMICs

Pavlidis, Spyridon; Alexopoulos, George S.; Ulusoy, Ahmet Çağrı; Cho, Moon-Kyu; Papapolymerou, John

doi:10.1109/tmtt.2016.2630067

Cited by 11 publications

(2 citation statements)

References 28 publications

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“…Because of the good electrical performance and high reliability of ceramic package, early RF systems mostly adopted integration solutions based on ceramic packages [10,11,12,13,14,15,16], but stacked ceramic packages are costly, heavy, and hard to fabricate. Besides, the 3D packaging form based on organic substrates has the disadvantages of poor heat dissipation and low process accuracy although the packaging cost is low [17,18,19,20,21,22,23].…”

Section: Introductionmentioning

confidence: 99%

Design of a Ka-band receiver front end using Si-based system in package

Zhu

Jun

Wang

et al. 2021

IEICE Electron. Express

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This letter presents a Ka-band receiver front end in the form of system in package using silicon substrate. The front end adopts a dualchannel superheterodyne structure, two GaAs downconverter chips and a power divider chip are integrated on the silicon substrate with an embedded substrate integrated waveguide bandpass filter. Wire-bonding is used for connections and unique impedance matching structure is designed and embedded into the GSG transmission line to compensate for additional insertion loss. The test results show a conversion gain of -13.4 dB without the gain of low noise amplifier. The work in this letter is one of few presentation of a RF system in the form of stacked silicon system in package, revealing the feasibility of stacked silicon in complex RF system implement.

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Section: Introductionmentioning

confidence: 99%

Design of a Ka-band receiver front end using Si-based system in package

Zhu

Jun

Wang

et al. 2021

IEICE Electron. Express

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“…These ask the system to have the abilities of automatic test item switching and high-speed measurement. Furthermore, with the development of semiconductor technology, the MMICs' performance, together with their highest operation frequencies and integration level, keep rising [2][3][4][5][6][7][8], which require the automatic system to have stronger abilities. Traditional test systems can either measure partial indicators of the MMICs or try to achieve the whole data by handling many instruments with a complex switch system.…”

Section: Introductionmentioning

confidence: 99%

All-in-One Wafer-Level Solution for MMIC Automatic Testing

et al. 2018

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In this paper, we present an all-in-one wafer-level solution for MMIC (monolithic microwave integrated circuit) automatic testing. The OSL (open short load) two tier de-embedding, the calibration verification model, the accurate PAE (power added efficiency) testing, and the optimized vector cold source NF (noise figure) measurement techniques are integrated in this solution to improve the measurement accuracy. A dual-core topology formed by an IPC (industrial personal computer) and a VNA (vector network analyzer), and an automatic test software based on a three-level driver architecture, are applied to enhance the test efficiency. The benefit from this solution is that all the data of a MMIC can be achieved in only one contact, which shows state-of-the-art accuracy and efficiency.

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