2005 7th Electronic Packaging Technology Conference
DOI: 10.1109/eptc.2005.1614372
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Encapsulation and Packaging of Biosensor

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Cited by 5 publications
(6 citation statements)
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“…Fan et al [ 131 ] coated a wafer with a photo-imageable material and used lithography to create a protective layer on the sensor’s sensing area. The protective layer was removed after encapsulation, leaving contact holes on the biosensor module in the sensing area ( Figure 8 a).…”
Section: Biosensor Packagingmentioning
confidence: 99%
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“…Fan et al [ 131 ] coated a wafer with a photo-imageable material and used lithography to create a protective layer on the sensor’s sensing area. The protective layer was removed after encapsulation, leaving contact holes on the biosensor module in the sensing area ( Figure 8 a).…”
Section: Biosensor Packagingmentioning
confidence: 99%
“… Current, more feasible biosensor packaging technology. ( a ) Photolithography defines the package protection layer and leaves contact holes for the sensing area on the packaged biosensor module [ 131 ]. (Copyright © 2005, In Proceedings of the 2005 7th Electronic Packaging Technology Conference.)…”
Section: Figurementioning
confidence: 99%
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“…17 Schematics of polymeric microfl uidic devices: (a) SU-8 microchannel; (b) polydimethylsiloxane (PDMS) on SU-. Biosensor packaging process using the sensor area sacrifi cial layer method[33]. Biosensor packaging process using the sensor area sacrifi cial layer method[33].…”
mentioning
confidence: 99%
“…8 19. 18 Biosensor packaging process using the protective dam method[33]. 18 Biosensor packaging process using the protective dam method[33].…”
mentioning
confidence: 99%