Energy-Aware Signal Integrity Analysis for High-Speed PCB Links

Müller, Sebastian; Reuschel, Torsten; Rimolo-Donadío, Renato; Kwark, Young; Brüns, Heinz-Dietrich; Schuster, Christian

doi:10.1109/temc.2015.2427362

Cited by 16 publications

(12 citation statements)

References 23 publications

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“…increasing performance requirements within the PCB industry, such as larger aspect ratio, driven by a demand for a higher number of electronic components and stacking densities of PCB layer. The technological growth of high-value PCBs is currently driven by the development of boards which can propagate high frequency signals above 1 GHz (Okubo et al, 2013) with transmission speeds over 25 Gb/s (Muller et al, 2015) and at low bit error rates. Additionally, small track feature sizes are desired to allow for large board component densities.…”

mentioning

confidence: 99%

Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Jones¹,

Flynn²,

Desmulliez³

et al. 2016

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Purpose ± A study of the influence of megasonic (MS) assisted agitation on Printed Circuit Boards (PCBs) electroplated using copper electrolyte solutions, to improve plating efficiencies through enhanced ion transportation. Design/methodology/approach-The impact of MS assisted agitation on topographical properties of the electroplated surfaces studied, through a Design of Experiments (DOE), by measuring surface roughness, characterised by values of the parameter Ra as measured by white light phase shifting interferometry and high resolution scanning electron microscopy. Findings ± An increase of Ra from 400 nm to 760 nm measured after plating, for an increase to acoustic power from 45 W to 450 W. Roughening increase due to micro-bubble cavitation energy, supported through direct imaging of the cavitation. Current thieving effect by the MS transducer induced low-currents, leading to large Cu grain frosting reducing the board quality. Current thieving was negated in plating trials through specific placement of transducer. Wavy electroplated surfaces, due to surface acoustic waves, also observed reducing the uniformity of the deposit. Research limitations/implications ± The formation of unstable transient cavitation and variation of the topology of the copper surface are unwanted phenomena. Further plating studies using megasonic agitation are needed, along with fundamental simulations, to determine how the effects can be reduced or prevented. Practical implications ± Identify manufacturing settings required for high-quality MS assisted plating and promote areas for further investigation, leading to the development of an MS plating manufacturing technique. Originality/value ± Quantification of the topographical changes to a PCB surface in response to megasonic agitation and evidence for deposited copper artefacts due to acoustic effects.

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mentioning

confidence: 99%

Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Jones¹,

Flynn²,

Desmulliez³

et al. 2016

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“…In such cases, the trace time delay can be easily greater than that of the gate circuits for high density and high speed on chip circuits. The crosstalk noise among traces and circuits has become an unavoidable bottleneck in signal integrity design [4][5][6][7]. To overcome the limitation of global trace interconnection and to solve signal integrity issues in ultralarge-scale integrated circuits (ULSICs), such as system-on-chip (SoC) or network-on-chip (NoC), the on-chip antenna-based wireless interconnection method has been developed [8][9][10][11][12][13][14][15][16].…”

Section: Introductionmentioning

confidence: 99%

Enhancement of transmission characteristics for the antenna system printed on silicon wafer substrate by using FSS‐based coplanar parallel reflector

Yang

Chen²,

et al. 2019

IET Microwaves, Antennas & Propagation

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Here, a silicon‐substrate‐based four element antenna system is investigated by using a coplanar frequency selective surface (FSS) as a novel parallel reflector to improve radiation and transmission characteristics of the antennas. The four antennas are arranged around the square FSS, and one of the antennas is used as the transmitting element, while the other three as the receiving ones. It is found that, owing to the stopband filtering and the linearly changing reflection phase of the designed coplanar FSS, the gain and directivity of the transmitting antenna have been greatly improved, and that the antenna system transmission coefficients, including S21, S31 and S41, have been significantly increased. Two types of the antenna systems have been designed and fabricated on a P‐type silicon wafer substrate for the cases with and without a coplanar FSS reflector. The measured S‐parameters are essentially consistent with those simulated. In comparison with the case without the FSS, the transmission coefficients of S21, S31 and S41 for the system with the FSS have been increased about 6.42, 5.97 and 5.89 dB at the center frequency of 5.42 GHz, respectively. Furthermore, the proposed coplanar FSS exhibits distinct advantage of low‐profile compared to the conventional vertical FSS reflector.

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“…In addition, the parasitic effects degrade undeniably the PCB performances . It was predicted that this high‐density configuration requires a consideration of the signal integrity and power integrity effects . Therefore, optimization techniques have been proposed to improve the signal transmission link .…”

Section: Introductionmentioning

confidence: 99%

“…15 It was predicted that this high-density configuration requires a consideration of the signal integrity and power integrity effects. [16][17][18][19] Therefore, optimization techniques have been proposed to improve the signal transmission link. 20,21 More accurate circuit modeling 22,23 and characterization techniques 24 are introduced.…”

Section: Introductionmentioning

confidence: 99%

Kron‐Branin modeling of symmetric star tree interconnect

Ravelo

Maurice

et al. 2018

Circuit Theory & Apps

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Summary An analytical modeling method of symmetric tree interconnect is developed in this paper. The tree topology is composed of multibranch distributed interconnects of printed circuit board (PCB). The interconnects are constituted by elementary transmission line (TL) defined by its characteristic impedance and propagation constant. The star symmetric tree model is built with the Kron‐Branin (KB) formalism elaborated with the graph topology. Reduction method allowing to simplify the graph from single‐input multiple‐output (SIMO) to single‐input single‐output (SISO) circuit is used. The interconnect tree branch currents are determined from the reduced SISO structure. The symmetric tree S‐parameter and access and transfer impedance models are expressed in function of constituting elementary TL parameters with the KB formalism. The particular behaviors of short‐circuit and open‐ended star tree are investigated versus the tree number of output branches. The developed KB model effectiveness is validated with microstrip star tree designed and simulated with a 3D electromagnetic computational and electronic circuit designer commercial tool. Three different proofs of concept (POC) of star trees comprised of three‐output, four‐output, and five‐output branches are computed. The simulated reflection and transmission coefficients from DC to 5 GHz are in good agreement with the KB models. The proposed model is potentially useful for the PCB complex interconnect modeling and signal integrity analysis.

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Energy-Aware Signal Integrity Analysis for High-Speed PCB Links

Cited by 16 publications

References 23 publications

Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Enhancement of transmission characteristics for the antenna system printed on silicon wafer substrate by using FSS‐based coplanar parallel reflector

Kron‐Branin modeling of symmetric star tree interconnect

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