Energy efficient liquid-thermoelectric hybrid cooling for hot-spot removal

Sahu, Vivek; Fedorov, Andrei G.; Joshi, Yogendra; Yazawa, Kazuaki; Ziabari, Amirkoushyar; Shakouri, Ali

doi:10.1109/stherm.2012.6188838

Cited by 15 publications

(9 citation statements)

References 7 publications

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“…Similarly, heat management is the limiting step in the further miniaturization of integrated circuits, many of which have time-dependent heat loads. [2][3][4] Solid-state compact coolers without moving parts are of high interest in thermal management [5][6][7] . They are particularly suitable to cooling problems where the thermal load is transient.…”

Section: Introductionmentioning

confidence: 99%

Active Peltier Coolers Based on Correlated and Magnon-Drag Metals

et al. 2019

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Active cooling systems use electrical work to bring a hot device (such as an integrated circuit) down to near ambient temperature by draining heat from the hot area of the device to a passive heat sink. Commercial thermoelectric modules are optimized for refrigeration, and are not ideal for active cooling. Refrigeration maintains a temperature that is below the ambient temperature in a device (such as a kitchen refrigerator) by pumping heat from the cold area of the device to a heat sink. The thermoelectric figure of merit zT is used traditionally to evaluate the performance of thermoelectric modules, including refrigeration modules. But, it is not a good indicator of the performance of active cooling materials. Here, we describe an efficient, all-solid-state active cooler based on the Peltier effect in metals with high thermoelectric power factor due to electron correlation effects (CePd 3 ) or magnon drag (Co) and high passive thermal conductivity. We show theoretically and experimentally that the effective thermal conductance under applied current can exceed the limits imposed by Fourier's heat conduction law. The designed device measures an effective thermal 2 conductance that is an order of magnitude larger than the passive thermal conductance at ΔT=1 K with the dynamic response of 4 seconds.

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Section: Introductionmentioning

confidence: 99%

Active Peltier Coolers Based on Correlated and Magnon-Drag Metals

et al. 2019

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“…Hybrid of TECs and liquid cooling via microchannels: Hybrid cooling with TECs and liquid cooling via microchannels has recently been proposed to efficiently remove highdensity hot spots [10], [7], [27]. Kaplan et al [10] introduce a CTM for this hybrid technique to show its superior cooling performance on high density hot spots when compared to liquid cooling via microchannels.…”

Section: Related Workmentioning

confidence: 99%

Two-Phase Vapor Chambers with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips

Yuan

Vaartstra

Shukla

et al. 2019

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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High power densities lead to thermal hot spots in modern processors. These power densities are expected to reach kW/cm 2 scale in future high-performance chips and this increase may significantly degrade performance and reliability, if not handled efficiently. Using two-phase vapor chambers (VCs) with micropillar wick evaporators is an emerging technique that removes heat through the evaporation process of a coolant and has the potential to remove high heat fluxes. In this cooling system, the coolant is supplied passively to the micropillar wick via capillary pumping, eliminating the need for an external pump and ensuring stable thinfilm flow. Evaluation of such an emerging cooling technique on realistic chip power densities and micropillar geometries necessitates accurate and fast thermal models. Although multiphysics simulators based on either finite-element or finitevolume methods are highly accurate, they have long design and simulation times. This paper introduces a novel compact thermal model capable of simulating two-phase vapor chambers with micropillar wick evaporators. In comparison to COMSOL, our model shows a competitively low error of 1.25 • C and a 214x speedup. We also present a comparison of the cooling performance of different cooling techniques such as a conventional heat sink, liquid cooling via microchannels, hybrid cooling using thermoelectric coolers and liquid cooling via microchannels, and two-phase VCs with micropillar wick evaporators for the first time. Based on our observations, twophase VCs and microchannel-based two-phase cooling show better cooling performance for hot spot power densities of less than 1500 W/cm 2 , while hybrid cooling achieves lower hot spot temperature and thermal gradients for hot spot power densities between 1500 and 2000 W/cm 2 .

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“…The electrical current spreads into the substrate similar to heat spreading. The model studied by Sahu et al [27] could be used. However, to avoid the complexity we instead, assume this to be a perfect electrode (no resistance).…”

Section: Spreading Joule Heating In the Silicon Substratementioning

confidence: 99%

Performance and mass optimization of thermoelectric microcoolers

Koh

Yazawa

Shakouri

2015

International Journal of Thermal Sciences

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a b s t r a c tWe report a scalable and parametric analysis of thermoelectric (TE) microcoolers for hotspot cooling based on analytic formulations. Design for minimizing cooling power and least mass or cost of TE material is an ultimate goal for electronic devices that require spot cooling beyond that provided by passive heat transport to the thermal ground. Performance of thermoelectric hotspot cooling on electronic devices depends on external thermal resistances, physical dimension (thickness) of the thermoelectric element, and the applied drive current. Active cooling located at the hotspot minimizes the cooling power and the internal heat generation from the TE element and also minimizes the additional driving power used for heat rejection with a preexisting air-cooling fan or a liquid-cooling pump. Electronic devices are required to operate below a specific temperature for functionality and high reliability. The hotspot cooler must be designed to deal with the amount of heat generated from the heat source with this temperature constraint. We investigate two design cases: 1) the maximum cooling and 2) the minimum drive current for a given hotspot temperature to obtain an improved coefficient-ofperformance (COP). The study explores the impact of individual thermoelectric material properties, i.e. Seebeck coefficient, electrical conductivity, and thermal conductivity to find the direction that should be taken with engineered materials. We show that COP up to 8 is possible for hotspot heat fluxes of about 80 W/cm 2 , if TE leg thickness is optimized to~20e30 microns with today's Bi 2 Te 3 material. Model shows that COP > 2e3 is possible for hotspot heat fluxes bigger than 200e300 W/cm 2 . We find that lowering the thermal conductivity have the greatest impact, resulting in a thinner element (and therefore lower cost) while maintaining the same figure-of-merit (ZT).

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Energy efficient liquid-thermoelectric hybrid cooling for hot-spot removal

Cited by 15 publications

References 7 publications

Active Peltier Coolers Based on Correlated and Magnon-Drag Metals

Active Peltier Coolers Based on Correlated and Magnon-Drag Metals

Two-Phase Vapor Chambers with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips

Performance and mass optimization of thermoelectric microcoolers

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