2017
DOI: 10.1149/2.0311708jss
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Enhanced Photovoltaic Characteristics of Screen-Printed Monocrystalline Silicon Solar Cells by Rear Electroplated Copper

Abstract: Improved photovoltaic characteristics for screen-printed monocrystalline silicon solar cells (SPSSCs) were demonstrated by electroplated copper (EPC) as the rear metallization. The Al back-surface-field (Al-BSF) formed by screen-printed (SP) Al paste was prepared as a seed layer for the EPC. The EPC parameters, including the current density, electroplating time, buffered-oxide-etch (BOE), and mixed HF/HNO3/H2O pretreatments, were investigated. The experimental results indicate that the relatively higher intens… Show more

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Cited by 2 publications
(4 citation statements)
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“…Furthermore, a thicker EPC contact layer was formed up to 50 min, as shown in Figure 11(d). A thicker EPC contact layer was demonstrated at a high EPC time resulting in a large series resistance [13]. Moreover, an excellent resistivity caused by the Cu crystal orientation of (111) was demonstrated for the EPC formed at a current density of 25 mA/cm 2 [13].…”
Section: Resultsmentioning
confidence: 91%
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“…Furthermore, a thicker EPC contact layer was formed up to 50 min, as shown in Figure 11(d). A thicker EPC contact layer was demonstrated at a high EPC time resulting in a large series resistance [13]. Moreover, an excellent resistivity caused by the Cu crystal orientation of (111) was demonstrated for the EPC formed at a current density of 25 mA/cm 2 [13].…”
Section: Resultsmentioning
confidence: 91%
“…A thicker EPC contact layer was demonstrated at a high EPC time resulting in a large series resistance [13]. Moreover, an excellent resistivity caused by the Cu crystal orientation of (111) was demonstrated for the EPC formed at a current density of 25 mA/cm 2 [13]. The reason can be attributed to the (111)-oriented copper film with no slip line [24].…”
Section: Resultsmentioning
confidence: 94%
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