Improved photovoltaic characteristics for screen-printed monocrystalline silicon solar cells (SPSSCs) were demonstrated by electroplated copper (EPC) as the rear metallization. The Al back-surface-field (Al-BSF) formed by screen-printed (SP) Al paste was prepared as a seed layer for the EPC. The EPC parameters, including the current density, electroplating time, buffered-oxide-etch (BOE), and mixed HF/HNO3/H2O pretreatments, were investigated. The experimental results indicate that the relatively higher intensity from the Cu (111) plane and the Cu (200) plane was demonstrated to be approximately 2.2 for the EPC at a current density of 25 mA/cm2. Excellent adhesion of up to 2.4 N/mm was demonstrated. The achievement of a conversion efficiency (CE) improvement of more than 1.8%, from 15.4% to 17.2% for SPSSCs with EPC as the rear contact, was determined. The enhancement could be attributed to the reduction of the series resistance (SR) and an increase in the adhesion between the Al-BSF and EPC.

Abstract-A narrowband reflection and/or transmission filter made of heterostructured multilayer with two different ultrathin metallic films is proposed. The multilayer structure is a cascaded system that is formed by using two narrowband reflection-and-transmission filters. Each individual filter is made of an ultrathin metal film in front of a planar Fabry-Perot resonator. Using the transfer matrix method in a stratified system, the optical filtering properties are theoretically investigated and analyzed. It is found that the reflection peak at the design wavelength in the original individual filter becomes a dip in the heterostructured filter. The role played by the stack number of Bragg reflector in the design of narrowband filter is also clearly elucidated.

No abstract

No abstract

Photovoltaic and physical characteristics of screen-printed monocrystalline silicon solar cells (SPMSCs) were presented with electroplated copper (EPC) as the rear contact. The boron back surface field (B-BSF) formed by spin-on doping and laser doping (LD) was prepared as a seed layer for the EPC. The LD parameters, including the laser focus, laser power, laser speed, and laser line pitch, were investigated. Moreover, the effects of KOH etching on the surface properties after the LD process were explored. Furthermore, to enhance the adhesion between the B-BSF seed layer and EPC contact layer, a laser pinhole process was proposed. Finally, the EPC processes with various electroplating times were addressed. The results revealed that the mechanism of enhancements could be attributed to a continuous B-BSF seed layer and a reduction of series resistance, as well as an increase of open-circuit voltage and adhesion between the B-BSF seed layer and EPC contact layer.