Improved photovoltaic characteristics for screen-printed monocrystalline silicon solar cells (SPSSCs) were demonstrated by electroplated copper (EPC) as the rear metallization. The Al back-surface-field (Al-BSF) formed by screen-printed (SP) Al paste was prepared as a seed layer for the EPC. The EPC parameters, including the current density, electroplating time, buffered-oxide-etch (BOE), and mixed HF/HNO3/H2O pretreatments, were investigated. The experimental results indicate that the relatively higher intensity from the Cu (111) plane and the Cu (200) plane was demonstrated to be approximately 2.2 for the EPC at a current density of 25 mA/cm2. Excellent adhesion of up to 2.4 N/mm was demonstrated. The achievement of a conversion efficiency (CE) improvement of more than 1.8%, from 15.4% to 17.2% for SPSSCs with EPC as the rear contact, was determined. The enhancement could be attributed to the reduction of the series resistance (SR) and an increase in the adhesion between the Al-BSF and EPC.