1997
DOI: 10.1063/1.366516
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Enhanced silicon oxide film growth on Si (100) using electron impact

Abstract: The effect of electron beam impact on the oxidation of Si (100) by oxygen has been studied using x-ray photoelectron spectroscopy and Auger electron spectroscopy. It was found that electron beam impact can enhance the oxidation of Si (100) by oxygen at low temperatures, resulting in silicon dioxide formation. Furthermore, electron energy-dependent film growth experiments were carried out on O2(a) and an electron attachment resonance energy of ∼10.1 eV was found. A possible electron-induced oxidation mechanism … Show more

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Cited by 42 publications
(16 citation statements)
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“…4) constant voltage during the write mode does not lead to an increase in the line aspect ratio. This observation is consistent with the proposed mechanisms describing an electric field enhanced [7±11] and/or electron impact enhanced [10,23] oxidation of the wafer surface.…”
supporting
confidence: 92%
“…4) constant voltage during the write mode does not lead to an increase in the line aspect ratio. This observation is consistent with the proposed mechanisms describing an electric field enhanced [7±11] and/or electron impact enhanced [10,23] oxidation of the wafer surface.…”
supporting
confidence: 92%
“…The contact angle of water, determined by contact‐angle goniometry studies using the sessile drop method,21 increased from θ =(31±1)° on unmodified quartz to a mean contact angle of θ =(75.8±1)° upon immobilization of 1 c on quartz. A mean monolayer thickness of 17.3(1) Å was determined by ellipsometry and is in good agreement with similar overcrowded alkene systems on a variety of surfaces previously reported by our group 22.…”
Section: Methodsmentioning
confidence: 99%
“…Thus the basic unit of the iron sublattice shrinks when nitrogen goes out of the specimen and expands when oxygen goes into the specimen, resulting in the diffusion of iron-sublatticerelated spots in the diffraction pattern. The role of the electron beam in the decomposition of Fe 4 N is to break Fe-N chemical bonds and then stimulate the desorption of nitrogen, while in the oxidation process it acts to stimulate the adsorption and ionization of oxygen to oxidize the excessive iron with the mechanism reported on Si [11], Al [13,14], and Fe [20] surfaces. The similar process due to electron irradiation has been observed in the oxidization of InP in a UHV chamber, which includes the dissociation of In-P chemical bonds, depletion of phosphorus, and oxidization of metallic indium [17].…”
mentioning
confidence: 99%