Enhanced thermal conductivity of epoxy nanocomposites filled with hybrid filler system of triethylenetetramine-functionalized multi-walled carbon nanotube/silane-modified nano-sized silicon carbide

Yang, Kai; Gu, Mingyuan

doi:10.1016/j.compositesa.2009.10.019

Cited by 193 publications

(101 citation statements)

References 25 publications

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“…In the literature, for further enhancement of thermal conductivity, the use of bimodal systems (one filler type with two different sizes and size distributions) [28][29][30][31], as well as hybrid systems (two or more different filler types with their special size and size distributions) [19,29] were investigated. According to Hong et al [29], in an epoxy composite with bimodal distributed AlN or BN filler the smaller particles fill the gaps between larger ones and a higher package density is reached.…”

Section: Thermally Conductive Polypropylenementioning

confidence: 99%

Preparation and properties of thermally conductive polypropylene composites

Standau¹

2016

Zeitschrift Kunststofftechnik

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Section: Thermally Conductive Polypropylenementioning

confidence: 99%

Preparation and properties of thermally conductive polypropylene composites

Standau¹

2016

Zeitschrift Kunststofftechnik

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“…In the FTIR spectrum of SiCw, the intensity of the peak at 800 cm 21 (SiAC) is obviously stronger than that at 1,100 cm 21 (SiAO), while in the spectrum of KH560-SiCw, the latter is stronger conversely. Furthermore, the band at 1,380 cm 21 ascribed to the CAH bond becomes remarkable in the case of KH560-SiCw, which suggests a coating of KH560 has been formed on the surface of SiCw [30,33,34].…”

Section: Characterization Of Surface-modified Fillersmentioning

confidence: 95%

Preparation and properties of epoxy/BN highly thermal conductive composites reinforced with SiC whisker

Tang

Kong

et al. 2015

Polym. Compos.

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A simple method is reported to increase the thermal conductivity and improve the poor mechanical properties caused by high filler loadings of epoxy composites, simultaneously. Epoxy composites were prepared with micro-boron nitride (BN) and silicon carbon whisker (SiCw) chemically treated by 3-aminopropyltriethoxysilane (KH550) and 3-glycidyloxypropyltrimethoxysilane (KH560), respectively. Effects of surface modification of BN particles on the thermal conductivity and flexural strength of epoxy/BN composites were investigated. About 3% SiCw particles grafted with KH560 were incorporated into composites with BN grafted with KH550, which led to about 13.8%-17.8% increase of the flexural strength as well as a marginal improvement of the thermal conductivity of composites, and they possessed good dielectric properties. In addition, dynamic mechanical analysis results showed that the storage modulus of composites increased significantly with the addition of fillers, while the glass transition temperature exhibited a slight decrease. POLYM. COMPOS., 00:000-000, 2015.

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“…Hence, a suitable strategy to prepare high-performance epoxybased composites with high thermal conductivity, high electrical insulation, low relative permittivity, low dielectric loss and low viscosity has been a critical issue for underfill process in electronic packaging. Early attempts were to incorporate ceramic fillers with high thermal conductivity into the epoxy resins, such as boron nitride (BN) [9], aluminum nitride (AlN) [10], aluminum oxide (Al 2 O 3 ) [11], and silicon carbide [12,13]. To achieve high thermal conductivity, high filler loading is often required leading to worsened mechanical properties and high viscosity which is unsuitable for underfill process [14].…”

Section: Introductionmentioning

confidence: 99%