Enhancement of Cleanliness and Deposition Rate by Understanding the Multiple Roles of the Showerhead Electrode in a Capacitively Coupled Plasma Reactor

Kim, Ho Jun

doi:10.3390/coatings11080999

Cited by 3 publications

(2 citation statements)

References 26 publications

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“…CCP with a SiH 4 /Ar mixture was simulated based on a 2D fluid model. The details of the fluid model used in this study were described in our previous papers [13,[16][17][18]31]. For comparison with the experimental values, non-isothermal conditions were used in the analysis of the gas temperature and density, and the transport phenomena of various neutral and ionic species were precisely considered.…”

Section: Numerical Modelmentioning

confidence: 99%

Numerical optimization of dielectric properties to achieve process uniformity in capacitively coupled plasma reactors

Kim,

Lee,

Park

2024

Plasma Sources Sci. Technol.

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This paper presents the results of our numerical analysis to optimize the dielectric properties to achieve process uniformity in the thin film deposition process using capacitively coupled plasma. The difference in the plasma density distribution was analyzed by changing the wafer material from silicon to quartz (or Teflon). Similarly, aluminum was compared with aluminum nitride as the electrode material, and the sidewall material was varied from quartz to a perfect dielectric to study the effect on the plasma characteristics. A two-dimensional self-consistent fluid model was used to analyze the spatial distribution of the plasma parameters. In terms of the process conditions, the gas pressure was set to 400 Pa, the input power was fixed to 100 W, and a radio frequency of 13.56 MHz was used. SiH4/Ar was used as the gas mixture, and these conditions were used as input for numerical simulations of the deposition state of the hydrogenated amorphous silicon layer. The radial spatial distribution of plasma parameters was confirmed to be modified by dielectric elements with low dielectric constants regardless of the type of element. Despite the thin wafer thickness, the use of a wafer with low permittivity weakens the electric field near the electrode edge due to the stronger surface charge effect. Additionally, by changing the material of the sidewall to a perfect dielectric, a more uniform distribution of plasma could be obtained. This is achieved as the peak values of the plasma parameters are located away from the wafer edge. Interestingly, the case in which half of the sidewall was specified as comprising a perfect dielectric and the other half quartz had a more uniform distribution than the case in which the sidewalls consisted entirely of a perfect dielectric.

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Section: Numerical Modelmentioning

confidence: 99%

Numerical optimization of dielectric properties to achieve process uniformity in capacitively coupled plasma reactors

Kim,

Lee,

Park

2024

Plasma Sources Sci. Technol.

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“…Details of the governing equations of the self-consistent CCP model adopted here are explained in the previous publications [10][11][12][13]25]. Therefore, for brevity, only brief accounts of the equations are provided here.…”

Section: Governing Equationsmentioning

confidence: 99%

Importance of Dielectric Elements for Attaining Process Uniformity in Capacitively Coupled Plasma Deposition Reactors

Kim

2022

Coatings

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In this study, the effect of dielectric elements on plasma radial uniformity was analyzed for a 300 mm wafer process in a capacitively coupled plasma deposition reactor. Based on a two-dimensional self-consistent fluid model, numerical simulations were performed for SiH4/He discharges at 1200 Pa and at the radio frequency of 13.56 MHz. Although in current plasma processes the wafer is often coated with non-conducting films and placed on a ceramic substrate, related materials have not been analyzed. Therefore, the plasma characteristics were studied in depth by changing the wafer material from silicon to quartz, the electrode material from aluminum to aluminum nitride, and the sidewall material from quartz to perfect dielectric. It was demonstrated that dielectric elements with a lower dielectric constant modify the spatial distributions of plasma parameters. In spite of the thinness of the wafer, as the dielectric constant of the wafer decreases, the electric field at the wafer edge becomes weaker owing to the stronger surface-charging effect. This gives rise to the relatively lower density of reactive species such as SiH2+, Si+, He*, and SiH3 near the wafer edge. In addition, radially uniform plasma was induced by the perfect dielectric sidewall, regardless of the dielectric constant of the wafer. This modification occurred because the radial positions of the peak values of the plasma parameters were moved away from the wafer edge. Therefore, the uniform distribution of the plasma density could be largely achieved by the optimal combination of dielectric elements.

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An Iterative Conceptual Design Process for Modular Product Based on Sustainable Analysis and Creative Template Method

Zhou

Zhao

et al. 2022

Processes

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The iterative design process of mechanical products has evolved towards a more sustainable direction driven by the concept of sustainable development. Modular design emphasizes the realization of user requirements under the condition of high efficiency and low cost, which is conducive to the diversification of product design. The sustainable innovative design methods are considered in modular design processes, which can improve the design capabilities of enterprises and enhance competitiveness. However, although the existing methods used in the iterative design of a product scheme contributes to satisfy the user requirements and generate the innovative scheme of the product, the sustainable design concepts such as the impact on the utilization of resources and environment during the iteration of the conceptual scheme and sustainability evaluation of product schemes have not been given sufficient attention. To resolve this, in this work, an iterative conceptual design process is proposed for modular products based on the sustainable analysis and creative template method. In this process, firstly, the KANO model is used to analyze the sustainable requirements of users. Secondly, a function behavior structure (FBS) model and creative template method are used to form sustainable innovative modular products conceptual design scheme. Finally, fuzzy analytic hierarchy process (FAHP) is used to evaluate the product scheme. The iterative conceptual design process proposed in this paper can be abbreviated as S-KFCF. The prototype conceptual scheme design of a novel low-temperature plasma deposition device is conducted. The results suggest that the proposed process could effectively reduce the total cost, shorten design cycles, increase product part recovery rates, and improve the environmental friendliness of the design schemes produced via sustainable analysis.

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Enhancement of Cleanliness and Deposition Rate by Understanding the Multiple Roles of the Showerhead Electrode in a Capacitively Coupled Plasma Reactor

Cited by 3 publications

References 26 publications

Numerical optimization of dielectric properties to achieve process uniformity in capacitively coupled plasma reactors

Numerical optimization of dielectric properties to achieve process uniformity in capacitively coupled plasma reactors

Importance of Dielectric Elements for Attaining Process Uniformity in Capacitively Coupled Plasma Deposition Reactors

An Iterative Conceptual Design Process for Modular Product Based on Sustainable Analysis and Creative Template Method

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