2002
DOI: 10.1063/1.1445810
|View full text |Cite
|
Sign up to set email alerts
|

Enhancing the surface passivation of TiO2 coated silicon wafers

Abstract: In this letter, we demonstrate good surface passivation of lightly diffused n-type solar cell emitters using titanium dioxide (TiO2) thin films treated with a furnace oxidation process. Transient-photoconductance decay, x-ray photoelectron spectroscopy, and scanning electron microscopy measurements indicate that the silicon dioxide layer formed at the TiO2:Si interface provides excellent surface passivation. Emitter dark saturation current densities of 4.7×10−14 A/cm2 are achieved by this method, demonstrating… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

1
45
0
3

Year Published

2002
2002
2021
2021

Publication Types

Select...
7
2

Relationship

0
9

Authors

Journals

citations
Cited by 71 publications
(49 citation statements)
references
References 14 publications
1
45
0
3
Order By: Relevance
“…O filme de dióxido de titânio é uma opção muito vantajosa, pois não é tóxico, tem alta resistência química, tem um alto índice de refração e um baixo índice de absorção [21]. O filme AR foi depositado por evaporação em alto vácuo com canhão de elétrons.…”
Section: Materiais E Métodosunclassified
“…O filme de dióxido de titânio é uma opção muito vantajosa, pois não é tóxico, tem alta resistência química, tem um alto índice de refração e um baixo índice de absorção [21]. O filme AR foi depositado por evaporação em alto vácuo com canhão de elétrons.…”
Section: Materiais E Métodosunclassified
“…[15][16][17][18][19] These layers are deposited on a thin, typically 200 Å oxide layer, which provides adequate interface passivation. SiO 2 for surface passivation is grown by high-temperature dry oxidation, typically at about 1,000°C in a conventional thermal furnace, followed by a forming gas anneal.…”
Section: Materials and Techniques For Dielectric Layersmentioning
confidence: 99%
“…Among the aforementioned materials, TiO 2 is the most attractive because it exhibits a smaller bandgap that ensures efficient carrier tunneling. Furthermore, TiO 2 was demonstrated to be an alternative to silicon nitride as a Si surface passivation layer [18]. However, CVD is a slow and expensive process that might limit productivity in the future.…”
Section: Introductionmentioning
confidence: 99%