Epoxy Composites Filled with Micro-Sized AlN Particles for Microelectronic Applications

Abstract

With the rapid development of the electronic information industry, better properties are required for substrate and packaging materials such as high thermal conductivity, low coefficient of thermal expansion, and low dielectric constant. Polymers are ordinarily being used for this purpose due to their high electrical resistivity and low density, but unfortunately they suffer from a disadvantage like low thermal conductivity. To offset this deficiency, adding inorganic conductive particles to polymer is a versatile method. In view of this, the present work aims at developing a class of particulate filled polymer composites with micro-sized aluminum nitride (AlN) particles having an average particle size of 60-80 mm reinforced in epoxy matrix. A set of composites, with filler content ranging from 0 to 25 vol%, have been prepared by the hand-layup technique. Effects of filler percentage on various properties like effective thermal conductivity (k eff ), coefficient of thermal expansion (CTE), glass transition temperature (T g ), and dielectric constant (E c ) are studied. It is found that the incorporation of AlN in resin increases the k eff and T g , whereas CTE of the composite decreases favorably. Though dielectric constant of the matrix increases with filler content yet it remains well within the desirable limit. With modified thermal and dielectric characteristics, these composites can possibly be used for microelectronics applications.

Thermal conductivity of epoxy resin composites filled with combustion‐synthesized AlN powder

“…However, the thermal conductivity is seen to increase at a much higher rate as the filler content is increased to beyond ∼40 vol%. Similar phenomena were also observed by many other studies and were considered to be due to the formation of a continuous network (i.e., continuous thermal conduction path) of the filler particles . The continuous network is found in this study to begin to form as the filler content is increased to beyond ∼40 vol%, thus causing a faster increase of the thermal conductivity.…”

“…Although many studies have been devoted to study the processing and characterization of polymer composites filled with AlN . The data and the results are often scattered and inconsistent.…”

Thermal behavior and dielectric response of epoxy–boron nitride composites reinforced with short human hair fiber

“…[11][12][13] Earlier, many researchers have tried to improve the conductivity of the polymer with the incorporation of various types of traditional carbonaceous [14,15] (e.g., carbon black, graphite particulate) and metallic [16][17][18] (e.g., aluminum, copper, nickel) fillers. Some other researchers have also concentrated on composites with different types of potential ceramic fillers such as aluminum nitride (AlN), [19,20] alumina (Al 2 O 3 ), [21,22] silicon carbide (SiC), [23,24] and silicon nitride (Si 3 N 4 ). [25,26] Addition of these fillers substantially enhanced the thermal conduction behavior of the composite while mechanical properties as well as electrical insulation behavior of the composite have been severely deteriorated.…”

Enhancing the thermal conductivities of aluminum nitride‐ polydimethylsiloxane composites via tailoring of thermal losses in filler networks

“…Thus, numerous researchers are interested in developing thermally conductive polymer composites as heat spreaders for these miniature, integrated, and functional devices. Thermally conductive polymer composites have the advantages of corrosion resistance, low weight, easy processing, easy compliance to the adjacent rough surfaces when flexible polymers are utilized, and electrical insulation or conduction controlled by selecting appropriate fillers [ 4–6 ] .…”