Equipment, materials and processes: a review of high rate sputtering technology for glass coating

Nadel, S.; Greene, P.D.; Rietzel, J.; Strümpfel, J.

doi:10.1016/s0040-6090(03)00930-1

Cited by 33 publications

(14 citation statements)

References 4 publications

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“…Over the past decades magnetron sputtering has become an extremely important technology for thin film deposition in a wide range of industrial applications. These include metalization in integrated circuits, 9,14 coatings for wear resistance and corrosion protection, 78 large area coating of architectural glass, 79 and display applications. 80 Depending on the application the applied target voltage can be dc, radio frequency, 81 or pulsed.…”

Section: B Modifications To the Magnetron Sputtering Dischargementioning

confidence: 99%

“…80 The rotating magnetron sputtering discharge is widely used for large-scale industrial applications, in particular in large in-line flat glass coating plants. 79 For large area coatings, using a typical in-line coater, the substrate is moved relative to the magnetron cathode target in a linear fashion. In particular for reactive sputtering the active region of the rotatable target is maintained free of dielectric layer build up due to continuous sputtering with rapid rotation speeds (20 rpm).…”

Section: Discharge Configurationmentioning

confidence: 99%

“…In particular for reactive sputtering the active region of the rotatable target is maintained free of dielectric layer build up due to continuous sputtering with rapid rotation speeds (20 rpm). 79 It is difficult to coat uniformly complex components at acceptable rates from a single source. Therefore, in order to exploit the magnetron sputtering technology to large scale, industrial systems consisting of multiple magnetron sputtering targets have been developed.…”

Section: Discharge Configurationmentioning

confidence: 99%

See 2 more Smart Citations

High power impulse magnetron sputtering discharge

Guðmundsson¹,

Brenning²,

Lundin³

et al. 2012

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

637

446

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The high power impulse magnetron sputtering (HiPIMS) discharge is a recent addition to plasma based sputtering technology. In HiPIMS, high power is applied to the magnetron target in unipolar pulses at low duty cycle and low repetition frequency while keeping the average power about 2 orders of magnitude lower than the peak power. This results in a high plasma density, and high ionization fraction of the sputtered vapor, which allows better control of the film growth by controlling the energy and direction of the deposition species. This is a significant advantage over conventional dc magnetron sputtering where the sputtered vapor consists mainly of neutral species. The HiPIMS discharge is now an established ionized physical vapor deposition technique, which is easily scalable and has been successfully introduced into various industrial applications. The authors give an overview of the development of the HiPIMS discharge, and the underlying mechanisms that dictate the discharge properties. First, an introduction to the magnetron sputtering discharge and its various configurations and modifications is given. Then the development and properties of the high power pulsed power supply are discussed, followed by an overview of the measured plasma parameters in the HiPIMS discharge, the electron energy and density, the ion energy, ion flux and plasma composition, and a discussion on the deposition rate. Finally, some of the models that have been developed to gain understanding of the discharge processes are reviewed, including the phenomenological material pathway model, and the ionization region model.

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Section: B Modifications To the Magnetron Sputtering Dischargementioning

confidence: 99%

Section: Discharge Configurationmentioning

confidence: 99%

Section: Discharge Configurationmentioning

confidence: 99%

See 1 more Smart Citation

High power impulse magnetron sputtering discharge

Guðmundsson¹,

Brenning²,

Lundin³

et al. 2012

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

637

446

View full text Add to dashboard Cite

show abstract

“…Magnetron sputtering is an established tool for high rate and large area deposition of highquality thin films [1]. The structure and properties of these coatings can be controlled by the parameters of the discharge such as the density and energy of the particles, i.e.…”

Section: Introductionmentioning

confidence: 99%

Spatial and temporal development of the plasma potential in differently configured pulsed magnetron discharges

Welzel¹,

Dunger

Liebig

et al. 2008

New J. Phys.

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T h e o p e n -a c c e s s j o u r n a l f o r p h y s i c s Abstract. Time-resolved emissive probe measurements have been performed to study the spatio-temporal development of the plasma potential in an asymmetric bipolar pulsed magnetron discharge. The influence of the substrate potential as well as of the substrate position has been investigated while the further conditions were the same. To access the entire potential range which was between −100 V and + 400 V and to obtain sufficient time-resolution of the emissive probe, different heating currents had to be used. The plasma potential has been found to be typically close to zero in the 'on' phase, about + 40 V in the stable 'off' phase and up to + 400 V at the beginning of the 'off' phase, which is in agreement with the results of other authors. However, the positive values in the 'off' phase are generally lower than those reported and stay mostly below the target potential. This is explained by macroscopic considerations of the quasineutrality of the plasma taking into account a magnetic and geometrical shielding of the target, acting as an anode in the 'off' phase, and the potential and position of the substrate holder and environment. New Journal of Physics

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“…ITO thin films can be prepared using many techniques, including e-beam evaporation [5,6], plasma-enhanced metal organic chemical vapor deposition [7], pulsed laser deposition [8], dip coating [9], ion beam sputtering [10], magnetron sputtering [11], and thermal evaporation [12]. Among these for forming ITO thin films, magnetron sputtering has the advantage of being able to form films of high quality at room temperature [13][14][15][16], which can be used to coat large areas [17,18]. Postdeposition annealing at temperatures of more than 200 ∘ C has been shown to be effective in improving the grain growth and crystallinity of ITO thin films [19][20][21].…”

Section: Introductionmentioning

confidence: 99%

Improving Performance of CIGS Solar Cells by Annealing ITO Thin Films Electrodes

Chuang

Chang

Chen

et al. 2015

International Journal of Photoenergy

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Indium tin oxide (ITO) thin films were grown on glass substrates by direct current (DC) reactive magnetron sputtering at room temperature. Annealing at the optimal temperature can considerably improve the composition, structure, optical properties, and electrical properties of the ITO film. An ITO sample with a favorable crystalline structure was obtained by annealing in fixed oxygen/argon ratio of 0.03 at 400°C for 30 min. The carrier concentration, mobility, resistivity, band gap, transmission in the visible-light region, and transmission in the near-IR regions of the ITO sample were-1.6E+20 cm−3,2.7E+01 cm2/Vs,1.4E-03 Ohm-cm, 3.2 eV, 89.1%, and 94.7%, respectively. Thus, annealing improved the average transmissions (400–1200 nm) of the ITO film by 16.36%. Moreover, annealing a copper-indium-gallium-diselenide (CIGS) solar cell at 400°C for 30 min in air improved its efficiency by 18.75%. The characteristics of annealing ITO films importantly affect the structural, morphological, electrical, and optical properties of ITO films that are used in solar cells.

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Equipment, materials and processes: a review of high rate sputtering technology for glass coating

Cited by 33 publications

References 4 publications

High power impulse magnetron sputtering discharge

High power impulse magnetron sputtering discharge

Spatial and temporal development of the plasma potential in differently configured pulsed magnetron discharges

Improving Performance of CIGS Solar Cells by Annealing ITO Thin Films Electrodes

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