2003
DOI: 10.1016/s0038-1101(02)00407-0
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Er diffusion into gallium nitride

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Cited by 3 publications
(3 citation statements)
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“…Similar SF loop features are also found in plasma-assisted MBE grown GaN layers [33,34] and rare-earth implanted GaN layers [35]. Based on the experimental results on Er depth profiles in GaN thin layers through thermal diffusion, an activation energy barrier for diffusion been deduced to be 1 ± 0.4 eV [36,37]. The authors claim that such a low diffusion barrier is explainable by an interstitial-assisted mechanism.…”
Section: Discussionsupporting
confidence: 60%
“…Similar SF loop features are also found in plasma-assisted MBE grown GaN layers [33,34] and rare-earth implanted GaN layers [35]. Based on the experimental results on Er depth profiles in GaN thin layers through thermal diffusion, an activation energy barrier for diffusion been deduced to be 1 ± 0.4 eV [36,37]. The authors claim that such a low diffusion barrier is explainable by an interstitial-assisted mechanism.…”
Section: Discussionsupporting
confidence: 60%
“…Figure 1 shows the Nd concentration profile in the diffused samples after 15 hour annealing at 800°C. Ting et al performed SIMS measurements on GaErN via thermal diffusion in a furnace at 800°C under a flowing nitrogen atmosphere for 7.5-119 hours, and calculated the diffusion coefficient (at 800°C) of Er in GaN through an Arrhenius expression to be D = 2 ± 1.1 x 10 -17 cm 2 /s [4,5]. The diffusion depth was estimated to be ~16nm for the template grown with 3sccm silane, and ~32nm for the template grown with 1.5sccm silane.…”
Section: Resultsmentioning
confidence: 99%
“…The second possibility is to use so called "doping in situ" [14], [15]. The last method for the GaN layers doping by the RE ions is diffusion [16] though this method has limited use mainly due to a low diffusivity of the RE ions [17]. MOCVD provides a rather easy way how to fabricate the GaN layers though it has not yet allows for direct (in situ) doping with the RE ions, that must be incorporated by a successive ion implantation.…”
Section: Introductionmentioning
confidence: 99%