Erratum: “Copper electroplating for future ultralarge scale integration interconnection” [J. Vac. Sci. Technol. A <b>18</b>, 656 (2000)]

Gau, W. C.; Chang, T. C.; Lin, Yung-Hsiang; Hu, Jiumei; Chen, L. J.; Chang, Chia-Seng; Cheng, Chao-Lin

doi:10.1116/1.1286102

Cited by 4 publications

(4 citation statements)

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“…The electrical resistivity values of all copper layers are relatively similar as they vary within a range between 3.8 and 5.7 μΩ cm. These values are in accordance with reported values for electroplated (2.0-8.3 μΩ cm) [53] or electroless (3.3-6.2 μΩ cm) [54] copper films. The electrical resistivity of bulk copper is 1.78 μΩ cm.…”

Section: Electrical Properties Of Copper Layerssupporting

confidence: 92%

Selective Metallization of Polymers: Surface Activation of Polybutylene Terephthalate (PBT) Assisted by Picosecond Laser Pulses

et al. 2021

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The selective metallization of nonconductive polymer materials has broad applications in the fields of integrated circuit technology and metallized patterns. This work discusses a methodology to pattern metal tracks on polybutylene terephthalate substrates. The process consists of three steps: 1) surface patterning with picosecond laser pulses (1030 nm) in air, 2) Pd seeding via treatment in PdCl2 solution, and 3) selective metallization via electroless copper deposition. Picosecond laser irradiation promotes not only surface roughening but also chemical modification to enable Pd seeding as the polymer surface acquires the ability to reduce Pd(II)‐chloride species to metallic Pd. The laser parameters, as well as the PdCl2 concentration and seeding temperature, have an influence on the polymer surface morphology, the concentration and distribution of metallic Pd, and the copper layer properties. Homogeneous copper layers with well‐defined geometries, good coating‐substrate adhesion, and high electrical conductivity can be obtained. This is ascribed to the synergistic effect of the chemical surface activation and roughness development (from 0.13 to ≈1.6 μm). As the patterning and surface activation are performed in air, directly on the as‐received polymer substrate, this methodology shows great potential for metallization of electronic devices with 3D complex geometries.

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Section: Electrical Properties Of Copper Layerssupporting

confidence: 92%

Selective Metallization of Polymers: Surface Activation of Polybutylene Terephthalate (PBT) Assisted by Picosecond Laser Pulses

et al. 2021

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“…Additionally, in previous papers, [18][19][20][21] Kelly and coworkers showed that the leveling of 0.2 m trenches by an acid copper electrolyte with polyethylene glycol ͑PEG͒, Cl Ϫ , bis͑3-sulfopropyl͒ disulfide, and Janus Green B. Gau and co-workers demonstrated that copper could be electroplated into a 0.3 m dimension with an aspect ratio of 3 trenches by adding hydroxyl amine sulfate in the electrolyte.…”

Section: B Polarization Effects On Filling Capabilitymentioning

confidence: 99%

Investigations of effects of bias polarization and chemical parameters on morphology and filling capability of 130 nm damascene electroplated copper

Chang

Shieh

Lin

et al. 2001

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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Through elucidating the effects of current density, cupric ion concentration, bath temperature, and air agitation on plating uniformity and filling capability of copper electroplating, the deposition of copper in an acid copper electrolyte will be illustrated to scale down to the sub-0.13 m features with uniform plating, which is required by chemical mechanical polishing in current damascene techniques. In order to achieve the defect-free filling in sub-0.13 m vias and trenches, the electrolyte must be composed of proper amounts of cupric ions, sulfuric acid, chloride ions, wetting agent, and filling promoter. The supplied current controlled at a lower current density, agitation acceded to the electroplating process were found as further keys. In the electrolyte, the filling promoter was consisted essentially of thiazole derivatives with benzyl groups and amino-group (ϪNH 2 ͒ offering sufficient inhibition on copper depositing and selective inhibition gradient. Moreover, a lower resistivity film and higher filling capability could be obtained by using periodic pulse current plating as compared with direct current plating.

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“…Secondarily, insulating layer such as SiO 2 is formed by thermal oxidation or vapor deposition (5). For the conductive filling of TSV, copper by electroplating is currently used in terms of cost and performance (6)(7)(8)(9). A diffusion barrier such as TiN is needed to prevent Cu to diffuse into the Si substrate and is formed by vapor deposition over the insulating layer (10).…”

Section: Introductionmentioning

confidence: 99%

(Invited) Conductive Polymer/Metal Composite for Filling of TSV

Kawakita

Chikyow

2017

ECS Trans.

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Toward fast formation of TSV for 3D-IC or 3D-LSI, a composite material with polypyrrole as a conducting polymer and metal silver prepared through the solution photo chemistry was studied with respect to filling status of vertical holes in silicon chip, electrical characteristics and interfacial structures between the filling composite and silicon substrate. Based on the experimental results, the composite was capable of filling within 10 minutes, evaluation procedures of electrical resistance were established and excellent barrier layer was found.

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Erratum: “Copper electroplating for future ultralarge scale integration interconnection” [J. Vac. Sci. Technol. A 18, 656 (2000)]

Abstract: ERRATA Erratum: ''Copper electroplating for future ultralarge scale integration interconnection'' †J.

Cited by 4 publications

References 0 publications

Selective Metallization of Polymers: Surface Activation of Polybutylene Terephthalate (PBT) Assisted by Picosecond Laser Pulses

Selective Metallization of Polymers: Surface Activation of Polybutylene Terephthalate (PBT) Assisted by Picosecond Laser Pulses

Investigations of effects of bias polarization and chemical parameters on morphology and filling capability of 130 nm damascene electroplated copper

(Invited) Conductive Polymer/Metal Composite for Filling of TSV

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