Erratum: "Copper electroplating for future ultralarge scale integration interconnection" [J.

ERRATA Erratum: ''Copper electroplating for future ultralarge scale integration interconnection'' †J.

No abstract

By dipping in a silanisation solution, a hydrophobic self-organized nanomolecular film ͑SOM͒ was successfully grown on the surface of dry-etched porous methyl silsesquioxane ͑DE-PMSQ͒. The reaction was spontaneous at room temperature. The moisture adsorption on the DE-PMSQ was avoided and the surface of the SOM/DE-PMSQ was rather smooth. Leakage current and dielectric constant measurements of DE-PMSQ and SOM/DE-PMSQ samples also showed consistent behavior. As a result, it is promising to use the low-k PMSQ as an inter-metal dielectric with hydrophobic SOM grown on DE-PMSQ.

No abstract