Estimation of Power Switching Current by Chip-Package-PCB Cosimulation

Park, Hyun Ho; Song, Seunghyun; Han, Sang-Tae; Jang, T.; Jung, Jinhwan; Park, Hark-Byeong

doi:10.1109/temc.2010.2043255

Cited by 14 publications

(7 citation statements)

References 14 publications

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“…In the next paragraphs, we consider that the dynamic current consumption waveform is a symmetrical triangular pulse. The peak amplitude of the pulse Imax is given by (6). From the resolution of the equations (3), (5), and (6) the maximum amplitude of the IA is calculated using the formula (7).…”

Section: B Presentation Of the Ia Construction Methodology For A Fpgmentioning

confidence: 99%

A new methodology to extract the ICEM-CE internal activity block of a FPGA

Ghfiri¹,

Durier

Boyer

et al. 2017

2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE

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Section: B Presentation Of the Ia Construction Methodology For A Fpgmentioning

confidence: 99%

A new methodology to extract the ICEM-CE internal activity block of a FPGA

Ghfiri¹,

Durier

Boyer

et al. 2017

2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE

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“…Therefore, the fitting problem on the sample data set {F measured } can be described by a nonlinear least squares problem as Equation (23).…”

Section: A Developed Vector Fitting Algorithmmentioning

confidence: 99%

“…Jean-Luc Levant, et al used the ICEM model to simulate and predict the jitter of the integrated phase-locked loop and provide a correction solution [22]. Hyun Ho Park, et al generated a macro model of the timing controller chip for running pseudo H pattern data from transistor level simulation and is used to estimate the power switching current on the printed circuit board (PCB) [23]. Abhishek Ramanujan, et al designed a common interchange format for ICEM based on the well-known extensible markup language format and applied to Atmega88 microcontrollers [13].…”

Section: Introductionmentioning

confidence: 99%

A Parametric Conducted Emission Modeling Method of a Switching Model Power Supply (SMPS) Chip by a Developed Vector Fitting Algorithm

2019

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This paper proposes a modeling method to establish a parametric-conducted emission model of a switching model power supply (SMPS) chip through a developed vector fitting algorithm. A common SMPS chip LTM8025 was taken as an example to explain the modeling process. According to the integrated circuit (IC) electromagnetic modeling (ICEM) standard, the parametric conducted emission model is divided into two parts: IC internal activity (ICIA) and IC passive distribution network (ICPDN). The parameters of ICIA are identified by measured data and correlated with key components; an improved vector-fitting algorithm is proposed to solve the fitting problem of ICPDN without phase information. This parametric model can be used with commercial simulation software together to achieve predictions of conducted emissions from power modules. The experiment results show that the maximum and 90% confidence interval of the forecast errors are 9.677 dB and (−4.56 dB, 6.52 dB) respectively, which achieve the international standard requirements and have sufficient accuracy and effectiveness.

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“…기존 연구에도 PCB 회로망의 부하 임피던스를 전자기 해석으로 구하여 능동 회로 해석에 반영함으로써, 전류 파형을 좀 더 정확히 구하고, 이로부터 EMI 특성을 예측 한 연구 결과가 발표된 바 있다 [4] . 본 논문은 회로에 흐르 는 전류를 정확히 계산할 뿐더러, 이 전류 분포를 활용하 여 칩 및 PCB 상에서 근접 자계 분포를 구하는 전자계 통 합 시뮬레이션 방법을 제시한다.…”

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Prediction of Near Magnetic Field Distribution of Switching ICs

Kim¹,

Song²,

Lee³

et al. 2015

The Journal of Korean Institute of Electromagnetic Engineering

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This work presents a method to predict the near magnetic field distribution on the digital switching circuit mounted on PCB using co-simulation of circuit and electromagnetic fields. The proposed method first obtains the normalized near field distribution by exciting the signal and power ports of the switching circuit using sinusoidal sources. Then the real near magnetic field distribution is determined by weighting the normalized field distribution using the current spectrum of the switching circuit. To confirm the proposed method, a switching IC with a ring oscillator and a output buffer is fabricated and measured in the form of chip-on-board. The surface magnetic field distribution is measured using a magnetic probe above the PCB and compared with the simulation results. Experimental results show the correspondence between simulation and measurement results within 10 dB up to fifth harmonics.

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Estimation of Power Switching Current by Chip-Package-PCB Cosimulation

Cited by 14 publications

References 14 publications

A new methodology to extract the ICEM-CE internal activity block of a FPGA

A new methodology to extract the ICEM-CE internal activity block of a FPGA

A Parametric Conducted Emission Modeling Method of a Switching Model Power Supply (SMPS) Chip by a Developed Vector Fitting Algorithm

Prediction of Near Magnetic Field Distribution of Switching ICs

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