2014
DOI: 10.1016/j.egypro.2014.08.086
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Etch-back of p+ Structures for Selective Boron Emitters in n-type c-Si Solar Cells

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Cited by 17 publications
(6 citation statements)
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“…In this regard, optimization of diffusion technology to form good-quality p-n junctions is the basis for realizing the high-efficiency potential of n-types and must be emphasized in the future. This is because the formation of p + diffused layers using BBr 3 is expected to maintain about 85% of the market share until 2029, as there is no viable alternative available [3, [9][10][11].…”
Section: Introductionmentioning
confidence: 99%
“…In this regard, optimization of diffusion technology to form good-quality p-n junctions is the basis for realizing the high-efficiency potential of n-types and must be emphasized in the future. This is because the formation of p + diffused layers using BBr 3 is expected to maintain about 85% of the market share until 2029, as there is no viable alternative available [3, [9][10][11].…”
Section: Introductionmentioning
confidence: 99%
“…Because BBr 3 diffusion always results in a nonuniform sheet resistance. 24,25) The nonuniform boron sheet resistance was also reported for the spin-on boron diffusion method, 26) and in both cases, the variation in the sheet resistance causes a variation in the lifetime. Figure 3 shows the saturation current density J 0e mapping of the p + np + symmetrical wafer that was measured in this study.…”
Section: Resultsmentioning
confidence: 83%
“…Depth d, maximum near-surface doping concentration N max , as well as the resulting doping profile could have an impact on shunting behavior. As higher R Pvalues for selectively doped, and thus deeper boron-doped emitters have been reported by Schiele et al [10], further investigations need to be performed to investigate whether or not the emitter depth is the only significant parameter.…”
Section: Resultsmentioning
confidence: 93%