2009
DOI: 10.1143/jjap.48.116513
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Etch Profile Control of W/TiN/HfSiON and W/TaSiN/HfSiON Full-Metal Gates

Abstract: W/TiN/HfSiON and W/TaSiN/HfSiON, equivalent oxide thickness (EOT) 1 nm, full-metal gate stacks were etched using CF 4 and SF 6 based gas chemistries. Vertical profiles were achieved for both TiN and TaSiN metal gates with gate lengths of 20 nm by controlling gas chemistry and pressure. The etch condition was changed from the high-pressure region to the low-pressure region immediately before the appearance of the underlying TaSiN surface by monitoring the thickness of the W layer to take advantage of both high-… Show more

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Cited by 5 publications
(2 citation statements)
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References 9 publications
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“…As the material of the amorphous MG for the FinFETs, TaSiN was used because of its thermal stability and suitability for a gate-first process. [21][22][23] As reported in Refs. 21 and 22, the TaSiN film was deposited by sputtering a TaSi 2 target with Ar/N 2 plasma, and the deposited TaSiN film was confirmed to be amorphous by X-ray diffraction (XRD) analysis and plane-view transmission electron microscopy (TEM) even after rapid thermal annealing (RTA) equivalent for source/drain (S/D) dopant activation.…”
Section: Sample Finfet Fabricationmentioning
confidence: 89%
“…As the material of the amorphous MG for the FinFETs, TaSiN was used because of its thermal stability and suitability for a gate-first process. [21][22][23] As reported in Refs. 21 and 22, the TaSiN film was deposited by sputtering a TaSi 2 target with Ar/N 2 plasma, and the deposited TaSiN film was confirmed to be amorphous by X-ray diffraction (XRD) analysis and plane-view transmission electron microscopy (TEM) even after rapid thermal annealing (RTA) equivalent for source/drain (S/D) dopant activation.…”
Section: Sample Finfet Fabricationmentioning
confidence: 89%
“…As a material of the amorphous MG, TaSiN was used because of its thermal stability and suitability for a gatefirst process. 9,[14][15][16] The TaSiN thin film was deposited by sputtering a Ta 67 Si 33 alloy target with N 2 =Ar plasma, in which the N 2 =Ar flow ratio was set at 2%. A polycrystalline TiN gate, which is commonly investigated as a gate-first MG, [17][18][19][20] was also examined for comparison.…”
mentioning
confidence: 99%