Evaluation of lead(Pb)-free ceramic ball grid array (CBGA): Wettability, microstructure and reliability

Farooq, Mukta; Ray, Siddharth S.; Sarkhel, A. K.; Goldsmith, C. C.

doi:10.1109/ectc.2001.927927

Cited by 7 publications

(6 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

Section: Sac305mentioning

confidence: 99%

“…More than 70% market for reflowing lead-free solders are in the SAC series. Due to having good mechanical properties, acceptable wetting properties, and suitable melting points, the International Printed Circuit Association has suggested that SAC-305 and SAC-396 will be the most widely used alloys in the future [10][11][12][13][14][15][16].Although SAC-305 alloy is widely used in electronics industry, it has several problems to be solved. One of the core issues pertaining to Abstract Sn96.5Ag3Cu0.5 (SAC305) is widely used as lead-free solder for surface mount technology (SMT) card assembly and for ball-grid-array (BGA) interconnection in the microelectronic packaging industry as solder balls and pastes.…”

mentioning

confidence: 99%

See 1 more Smart Citation

Effect of Lanthanum Doping on the Microstructure Evolution and Intermetallic Compound (IMC) Growth during Thermal Aging of SAC305 Solder Alloy

Yasmin¹,

Sadiq²,

Khan³

2013

J Material Sci Eng

View full text Add to dashboard Cite

Citation: Yasmin T, Sadiq M, Khan MI (2014) Effect of Lanthanum Doping on the Microstructure Evolution and Intermetallic Compound (IMC) Growth during Thermal Aging of SAC305 Solder Alloy. J Material Sci Eng 3: 141. SAC305Among the various lead-free solders SAC-305 alloy has emerged as the most widely accepted to replace Sn-Pb solders. It is widely used as lead-free solder for surface mount technology (SMT) card assembly and for ball-grid-array (BGA) interconnection in the microelectronic packaging industry as solder balls and pastes. More than 70% market for reflowing lead-free solders are in the SAC series. Due to having good mechanical properties, acceptable wetting properties, and suitable melting points, the International Printed Circuit Association has suggested that SAC-305 and SAC-396 will be the most widely used alloys in the future [10][11][12][13][14][15][16].Although SAC-305 alloy is widely used in electronics industry, it has several problems to be solved. One of the core issues pertaining to Abstract Sn96.5Ag3Cu0.5 (SAC305) is widely used as lead-free solder for surface mount technology (SMT) card assembly and for ball-grid-array (BGA) interconnection in the microelectronic packaging industry as solder balls and pastes. In this study the effects of Lanthanum (La) doping on SAC305 under thermal aging was investigated as function of intermetallic compounds (IMCs) growth and grain size evolution. The morphology of the microstructure was analyzed under Scanning Electron Microscope (SEM) and optical microscope, the elemental distribution was confirmed by Energy Dispersive Spectroscopy (EDS) and phase identification of the crystalline structure formed during thermal aging was confirmed by x-ray diffraction (XRD). It was found that the microstructure of SAC305 solder alloy changes significantly with addition of La. Quantitative analysis of grain size and intermetallic particle size was performed both for undoped and La-doped SAC305 alloys.The XRD and EDS tests found that the doping elements La exist in SAC305 solder alloy in two forms: as La element or as La5Sn3 IMC.The La-Sn IMC has complex branch structure [89], which is usually look like clusters of snowflakes [57] in SEM images. With the help of EDX analysis very high amount of La concentration of observed in these snowflakes. Moreover It was also observed that quantity La5Sn3 IMC depend upon the concentration La doping i.e. with high 0.5wt% of lanthanum bigger snowflakes has be observed as shown in Figure 8 while small isolated snow can be seen with less La doping which is consistent with the results of Min et al [25].La doping greatly reduces the Ag 3 Sn and Cu 6 Sn 5 particle size particle during thermal aging. Surface area averaged particle size of Cu 6 Sn 5 particles was obtained as per ASM handbook [95]. The particle sizes for the full data set are plotted in Figure 9 as function of La doping level. It can be seen that La doping effectively suppresses the growth of Ag 3 Sn and Cu 6 Sn 5 intermetallic particle.

show abstract

Section: Sac305mentioning

confidence: 99%

mentioning

confidence: 99%

Effect of Lanthanum Doping on the Microstructure Evolution and Intermetallic Compound (IMC) Growth during Thermal Aging of SAC305 Solder Alloy

Yasmin¹,

Sadiq²,

Khan³

2013

J Material Sci Eng

View full text Add to dashboard Cite

show abstract

“…However, a recent study has found that the addition of the nanoparticle size of Fe and Al 2 O 3 in SAC solder alloys can improve mechanical properties because of the formation of FeSn 2 intermetallic compounds and Al 2 O 3 nanoparticles serving as a grain refiner [3]. In the microelectronics packaging industry, SAC alloys are widely used as solder pastes in connecting chip parts and ball grid arrays (BGAs) [4]. Lead-free solder powders which are used in microelectronics applications strictly require high product qualities such as spherical shape, low oxygen content (~100 ppm), and narrow size distribution [5].…”

Section: Introductionmentioning

confidence: 99%

Effects of Operating Parameters on the Cut Size of Turbo Air Classifier for Particle Size Classification of SAC305 Lead-Free Solder Powder

et al. 2019

View full text Add to dashboard Cite

In the present study, the effects of operating parameters, namely, rotor speed, feed rate, and inlet air velocity, on the cut diameter of a cage-type separator were studied. The design of experiments (DOE) method was used to investigate the relationship between the operating parameters and the cut size. The experimental results were statistically analyzed using MINITAB 16 software. Both the rotor speed and air inlet velocity had significant main effects on the cut size. The feed rate was also significant but had a weak effect with respect to the rotor speed and inlet air velocity effects. The cut size decreased with an increase in rotor speed and increased with an increase in air inlet velocity. However, the cut size slightly decreased with an increase in feed rate. An empirical multiple-variable linear model for predicting the cut size of the classification was created and presented. The results derived from the statistical analysis were in good agreement with those from the experiments, additionally extended from the DOE. The optimal conditions for classification of SAC305 powder with size range 25–40 μm were obtained when the turbo air classifier was operated at rotor speed 406 RPM, the feed rate 4 kg/h, and the air velocity 5 m/s. The smallest cut size of the classifier was about 27.8 μm.

show abstract

“…Among various alloy systems that are considered as lead-free solder candidates, Sn-Ag-Cu alloys have been recognized as the most promising because of their relatively low melting temperature (compared with the Sn-Ag binary eutectic leadfree solder), superior mechanical properties, and good compatibility with other components [1][2][3]. Sn-Ag-Cu alloys are widely used as lead-free solutions for ball-grid-array (BGA) interconnection in the microelectronic packaging industry as solder balls and pastes [4].…”

Section: Introductionmentioning

confidence: 99%

Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

Lee

Mohamad

2013

Advances in Materials Science and Engineering

View full text Add to dashboard Cite

This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

show abstract

Evaluation of lead(Pb)-free ceramic ball grid array (CBGA): Wettability, microstructure and reliability

Abstract: Flip-chip carriers have become the preferred solution for high-performance ASIC and microprocessor devices.

Cited by 7 publications

References 1 publication

Effect of Lanthanum Doping on the Microstructure Evolution and Intermetallic Compound (IMC) Growth during Thermal Aging of SAC305 Solder Alloy

Effect of Lanthanum Doping on the Microstructure Evolution and Intermetallic Compound (IMC) Growth during Thermal Aging of SAC305 Solder Alloy

Effects of Operating Parameters on the Cut Size of Turbo Air Classifier for Particle Size Classification of SAC305 Lead-Free Solder Powder

Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

Contact Info

Product

Resources

About