Evaluation of properties of sputtered Ni/Cu films with different thicknesses of the Cu layer

Çölmekçi, Salih; Karpuz, Ali; Köçkar, Hakan

doi:10.1016/j.tsf.2021.138661

Cited by 8 publications

(3 citation statements)

References 28 publications

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“…In the dry process, given the typically limited adhesion between the conductive copper layer and the dielectric, an adhesion layer composed of metals, such as titanium and chromium, with a thickness of several 10 nm to several 100 nm is formed on the dielectric via sputtering to enhance adhesion. [18][19][20][21][22][23] Researchers have achieved high adhesion between the COP and the conductive copper layer using copper nitride as an adhesion layer. 24) However, forming a seed layer using a modified layer or an adhesion layer presents the following challenges.…”

Section: Introductionmentioning

confidence: 99%

Comparison of vacuum ultraviolet irradiation and oxygen plasma treatment as pretreatment for copper seed layer on cycloolefin polymer

Shimizu,

Fukada,

Endo

et al. 2024

Jpn. J. Appl. Phys.

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This study explores the factors governing the peel strength characteristics between a cycloolefin polymer (COP) film and a copper plating layer with a copper seed layer, for applying to antenna circuits in 6G communications. The peel strength depended on the surface modification methods as pretreatment for copper seed layer formation: vacuum ultraviolet (VUV) irradiation and oxygen plasma treatment. VUV irradiation induced a modified layer with brittleness on the COP surface, leading to substrate failure. Conversely, oxygen plasma treatment formed a quite thin modified layer and facilitated Cu2O formation by bonding functional groups on the topmost COP surface with copper in the seed layer at the interface between the COP film and the copper plating layer, resulting in interface failure rather than substrate failure. Therefore, enhancing peel strength involves preventing the formation of a modified layer on the surface and generating a significant quantity of functional groups on the topmost surface.

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Section: Introductionmentioning

confidence: 99%

Comparison of vacuum ultraviolet irradiation and oxygen plasma treatment as pretreatment for copper seed layer on cycloolefin polymer

Shimizu,

Fukada,

Endo

et al. 2024

Jpn. J. Appl. Phys.

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“…10,11 The vibrating sample (VSM) and superconducting quantum interference device (SQUID) magnetometry techniques are used to measure magnetization and coercivity of MNPs and solid magnetic films. [12][13][14] However, these techniques fail to map the magnetic signals of a single nanoparticle or small MNP clusters distributed on the polymer matrix.…”

Section: Introductionmentioning

confidence: 99%

Poly(vinyl alcohol)/sodium alginate/magnetite composites: magnetic force microscopy for tracking magnetic domains

et al. 2023

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“…Different annealing times at a constant high temperature [3] and annealing the sample after production at different temperatures [4] can be shown among the physical conditions that the films are exposed to after production. Some of the production parameters are the deposition rate [2], the different temperatures of the substrate [5], and the value of the layer thicknesses [6,7]. Cobalt is frequently used in applications where electrical, mechanical and magnetic properties are prominent and also investigated by many researchers to explore its various physical properties [8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Investigation of the effects of Cu layer thickness and annealing temperature under air atmosphere on the properties of Co/Cu multilayer films

Karpuz,

Köçkar,

Kaplan

2023

Phys. Scr.

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Co/Cu films were deposited by the sputtering technique. The effects of different thicknesses of non-magnetic (Cu) layers and annealing temperature on magneto-structural properties were investigated. Different thicknesses of Cu layers were determined as 34 nm, 10 nm, 4 nm. Additionally, two annealed situations were considered to investigate the annealing effect. While the first one is exposing the films to 80 oC and 130 oC for 240 s, second one is annealing the films at 180 oC for different exposure times (50 s and 150 s). All films that have different thicknesses of Cu layers crystallized in (111) plane of the face centered cubic (fcc) structure. The intensity of this peak increased with increasing Cu layers thickness. Variation in the thickness of Cu layers has an important effect on the film surface. Saturation magnetization (Ms), coercivity (Hc) and squareness (Mr/Ms, Mr: remanent magnetization) were considerably affected by variation of the Cu content and film surface caused by the change in the thickness of the Cu layers. The film with 4 nm Cu layer thickness has the highest Ms, lowest Hc values and high Mr/Ms ratio. This indicates magnetically high efficient compared to the other films in the same series. The fcc structure continued to exist for the films annealed at 80 oC and 130 oC for 240 s. It was found that the annealing procedure transfigured the film surface and the differences in Ms and Hc values can be mostly attributed to this transfiguration because of the same film content revealed. An increase in Ms value, and a slight decrease in Hc and Mr/Ms values were detected for the annealed film at 130 oC, compared to the film annealed at 80 oC. It was also seen that the film structure was damaged at 180 oC because of excessive heat transfer.

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Evaluation of properties of sputtered Ni/Cu films with different thicknesses of the Cu layer

Cited by 8 publications

References 28 publications

Comparison of vacuum ultraviolet irradiation and oxygen plasma treatment as pretreatment for copper seed layer on cycloolefin polymer

Comparison of vacuum ultraviolet irradiation and oxygen plasma treatment as pretreatment for copper seed layer on cycloolefin polymer

Poly(vinyl alcohol)/sodium alginate/magnetite composites: magnetic force microscopy for tracking magnetic domains

Investigation of the effects of Cu layer thickness and annealing temperature under air atmosphere on the properties of Co/Cu multilayer films

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