Evaluation of solder joint reliability between PWB and CSP by using high TCE ceramic material

Yonekura, H.; Higashi, Mitsutoshi; Hmada, N.; Yamaguchi, Kouichi; Kokubu, M.; Ikemizu, Morihiko; Nakano, Jiro; Yokoi, T.; Funakura, H.

doi:10.1109/ectc.1998.678899

Cited by 3 publications

(2 citation statements)

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“…The packages then were mounted on the IC integration area of LTCC-M back panel to electrically connect to the address electrodes. On the other hand, the reliability between the interposer and the main board is deeply influenced by CTE difference of them which usually causes to the failure of BGA connections [3].…”

Section: Driver Ic Integrationmentioning

confidence: 99%

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32.4: Driver IC Integrated LTCC‐M PDP Back Panel

Baik¹,

Ryu²,

Cho³

et al. 2001

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Currently Plasma Display Panel (PDP) is the best promising candidate for large area digital display, especially hang-on-thewall digital TVs. Many processes have been developed to manufacture the competitive PDP. We have researched the unique process for fabricating plasma display back panel by the Low Temperature Co-fired Ceramics on Metal (LTCC-M) technology, which is very simple and cost effective manufacturing process [1]. In the year 2000 we presented the evaluation results of 40" LTCC-M plasma display back panel and succeeded in fabricating LTCC-M PDP module [2]. In this paper, we present a new LTCC-M PDP back panel on which the driver ICs are integrated by using LTCC package technology. This new PDP back panel gives us many advantages by directly integrating the driver ICs, which leads to elimination of connection parts and driver IC's circuit boards, enhancing signal speed, reducing the PDP module size and lowering the material cost.

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Section: Driver Ic Integrationmentioning

confidence: 99%

“…The interposers were consisted of 3 different conductor pattern layers for wire-bonding and BGA packaging [3]. The photographs The wire-bonded topside was encapsulated by epoxy resin to protect from the severe environments.…”

Section: Number Of Ltcc Layersmentioning

confidence: 99%