2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) 2019
DOI: 10.1109/iwipp.2019.8799080
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Evaluation of the PCB-embedding technology for a 3.3 kW converter

Abstract: This paper presents a converter fully made using PCB embedding technology (including the semiconductor devices, but also their gate driver circuits as well as the passive components). This converter is rated at a high-power (3.3 kW) considering the PCB technology. Here, the focus is given to the experimental validation of the embedding process, with the characterization of many of the embedded devices (SiC MOS-FETs, diodes, capacitors). These results show that most of the components were unaffected by the proc… Show more

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Cited by 5 publications
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