Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits

Kapoor, Dipesh; Tan, Cher Ming; Sangwan, Vivek

doi:10.3390/app10030748

Cited by 7 publications

(3 citation statements)

References 33 publications

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“…LED Driver PCB with EMI filters. result more disperse, making it difficult to identify the hotspot as reported by [3].…”

Section: Device Under Studymentioning

confidence: 99%

“…To ensure that EMC is successfully incorporated, electromagnetic measurement of fabricated chips is usually performed after their design. However, with the increasing complexity of circuits, such measurement can be limited, especially when the designed chip is implemented in 3D-IC, as illustrated in [3] where the authors show that the locations of high EMEs can be confusing or misleading from the measurement of 3D-IC, when the distance of the measuring probe from the surface of IC is more than 40 µm.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Electromagnetic Hotspots Identification in Integrated Circuits

Kapoor¹,

Sangwan²,

Tan³

2019

PIER Letters

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Advancements in functionalities and operating frequencies of integrated circuits lead to the necessity to study Electromagnetic Compatibility/Electromagnetic Emissions (EMC/EMEs) from these devices. In this work, a methodology is developed, which combines near field electromagnetic measurements and 3D layout simulation of an Integrated Circuit (IC), to identify the sources of EME from a commercial IC. This methodology can help to narrow down the area of key importance with respect to EME sources, instead of the entire IC, before it is fabricated. Consequently, IC designers can optimize their design to minimize the EME before fabrication, saving cost and time significantly.

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“…LED Driver PCB with EMI filters. result more disperse, making it difficult to identify the hotspot as reported by [3].…”

Section: Device Under Studymentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Electromagnetic Hotspots Identification in Integrated Circuits

Kapoor¹,

Sangwan²,

Tan³

2019

PIER Letters

Self Cite

View full text Add to dashboard Cite

show abstract

“…In the general environment, the electromagnetic field level of the surrounding space is also gradually improved. When electronic equipment or systems work in such a complex environment, they have to evaluate their electromagnetic compatibility [3] .…”

Section: Introductionmentioning

confidence: 99%

Research on RF Voltage Measurement Method of Chip Pins

2022

IJFET

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As the core device of electronic equipment, integrated circuit (IC) usually produces large highfrequency electromagnetic interference. In order to study the generation mechanism and suppression methods of such noise, accurate noise measurement and extraction must be carried out. At present, the measurement standard of chip level electromagnetic compatibility is not perfect, and the high-frequency characteristics of pin noise are difficult to be measured accurately. In order to achieve accurate chip pin RF voltage measurement, this paper designs a chip pin RF voltage measurement method, establishes the 3D model of the chip pin RF voltage measurement module, studies the effects of its wiring, via, substrate dielectric constant and other parameters on its high-frequency signal transmission performance, and then optimizes the module. Simulation and experimental results show that the optimization method effectively improves its high-frequency signal transmission characteristics. Finally, the RF voltage of the output pin of the active crystal oscillator is extracted by using the detection system designed in this paper.

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From Light to Logic: Recent Advances in Optoelectronic Logic Gate

Kim,

Ahn,

Lee

et al. 2024

Small Science

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This review delves into the advancements in optoelectronic logic gate (OELG) devices, emphasizing their transformative potential in computational technology through the integration of optical and electronic components. OELGs present significant advantages over traditional electronic logic gates, including enhanced processing speed, bandwidth, and energy efficiency. The evolution of OELG architectures from single‐device, single‐logic systems to more sophisticated multidevice, multilogic, and reconfigurable OELGs is comprehensively explored. Key advancements include the development of materials and device structures enabling multifunctional logic operations and the incorporation of in‐memory functionalities, critical for applications in high‐performance computing and real‐time data processing. This review also addresses the challenges that need to be overcome, such as stability, durability, integration with existing semiconductor technologies, and efficiency. By summarizing current research and proposing future directions, this review aims to guide the ongoing development of next‐generation optoelectronic architectures, poised to redefine the landscape of optical computing, communication, and data processing.

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Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits

Cited by 7 publications

References 33 publications

Electromagnetic Hotspots Identification in Integrated Circuits

Electromagnetic Hotspots Identification in Integrated Circuits

Research on RF Voltage Measurement Method of Chip Pins

From Light to Logic: Recent Advances in Optoelectronic Logic Gate

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