Evaluation of the ultra thin multi die outline (Ulthimo) concept as a package for high frequency transistors

Samber, M. de; Yuan, Pigen; Caers, J.F.J.M.; Teo, Poi-Siong; Rotaru, Mihai

doi:10.1109/eptc.2003.1271503

Cited by 3 publications

(2 citation statements)

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“…A photograph of a section of a completed sensor chip is shown in figure 3. [15]. It starts with formation of a Au/Ni/Cu interconnection pattern on a thick copper carrier foil.…”

Section: Componentsmentioning

confidence: 99%

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Packaging of silicon sensors for microfluidic bio-analytical applications

Wimberger-Friedl

Nellissen

Weekamp

et al. 2008

J. Micromech. Microeng.

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Document VersionPublisher's PDF, also known as Version of Record (includes final page, issue and volume numbers)Please check the document version of this publication:• A submitted manuscript is the author's version of the article upon submission and before peer-review. There can be important differences between the submitted version and the official published version of record. People interested in the research are advised to contact the author for the final version of the publication, or visit the DOI to the publisher's website.• The final author version and the galley proof are versions of the publication after peer review.• The final published version features the final layout of the paper including the volume, issue and page numbers. General rights Copyright and moral rights for the publications made accessible in the public portal are retained by the authors and/or other copyright owners and it is a condition of accessing publications that users recognise and abide by the legal requirements associated with these rights. Link to publication• Users may download and print one copy of any publication from the public portal for the purpose of private study or research.• You may not further distribute the material or use it for any profit-making activity or commercial gain • You may freely distribute the URL identifying the publication in the public portal ? Take down policyIf you believe that this document breaches copyright please contact us providing details, and we will remove access to the work immediately and investigate your claim. Abstract A new industrial concept is presented for packaging biosensor chips in disposable microfluidic cartridges to enable medical diagnostic applications. The inorganic electronic substrates, such as silicon or glass, are integrated in a polymer package which provides the electrical and fluidic interconnections to the world and provides mechanical strength and protection for out-of-lab use. The demonstrated prototype consists of a molded interconnection device (MID), a silicon-based giant magneto-resistive (GMR) biosensor chip, a flex and a polymer fluidic part with integrated tubing. The various processes are compatible with mass manufacturing and run at a high yield. The devices show a reliable electrical interconnection between the sensor chip and readout electronics during extended wet operation. Sandwich immunoassays were carried out in the cartridges with surface functionalized sensor chips. Biological response curves were determined for different concentrations of parathyroid hormone (PTH) on the packaged biosensor, which demonstrates the functionality and biocompatibility of the devices. The new packaging concept provides a platform for easy further integration of electrical and fluidic functions, as for instance required for integrated molecular diagnostic devices in cost-effective mass manufacturing.

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“…A photograph of a section of a completed sensor chip is shown in figure 3. [15]. It starts with formation of a Au/Ni/Cu interconnection pattern on a thick copper carrier foil.…”

Section: Componentsmentioning

confidence: 99%

“…Manufacturing of the MID is done according to the Ulthimo technique [15]. It starts with formation of a Au/Ni/Cu interconnection pattern on a thick copper carrier foil.…”

Section: Midmentioning

confidence: 99%