Event-Driven Tactile Sensing System Including 100 CMOS-MEMS Integrated 3-Axis Force Sensors Based on Asynchronous Serial Bus Communication

Shao, Chenzhong; Hirano, Hideki; Miyaguchi, Hiroshi; Nomoto, M.; Muroyama, Masanori; Tanaka, Shuji

doi:10.1109/jsen.2020.2991259

Cited by 7 publications

(4 citation statements)

References 30 publications

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“…To install a large number of force sensors, in addition to the high sensing performance described above, sensing system mechanisms, such as signal processing and network structure, should be considered. In [45][46][47], a sensor platform LSI, which has sensor readout, signal processing, and sensing data transmission circuits, was introduced. Importantly, the LSI can be integrated with several types of MEMS-based sensors.…”

Section: Discussionmentioning

confidence: 99%

Micromechanical Force Sensor Using the Stress–Impedance Effect of Soft Magnetic FeCuNbSiB

Froemel

Diguet

Muroyama

2021

Sensors

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By using the stress–impedance (SI) effect of a soft magnetic amorphous FeCuNbSiB alloy, a micromachined force sensor was fabricated and characterized. The alloy was used as a sputtered thin film of 500 nm thickness. To clarify the SI effect in the used material as a thin film, its magnetic and mechanical properties were first investigated. The stress dependence of the magnetic permeability was shown to be caused by the used transducer effect. The sputtered thin film also exhibited a large yield strength of 983 GPa. Even though the fabrication technology for the device is very simple, characterization revealed a gauge factor (GF) of 756, which is several times larger than that achieved with conventional transducer effects, such as the piezoresistive effect. The fabricated device shows great application potential as a tactile sensor.

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Section: Discussionmentioning

confidence: 99%

Micromechanical Force Sensor Using the Stress–Impedance Effect of Soft Magnetic FeCuNbSiB

Froemel

Diguet

Muroyama

2021

Sensors

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“…3C). 22,23 Due to the improvement in simulation and fabrication techniques, applications for measuring small deflections and pressure, such as electrocardiograms (ECGs), have become possible (Fig. 3D).…”

Section: Pressure Sensorsmentioning

confidence: 99%

Recent advancements in physical and chemical MEMS sensors

Tanaka

2024

Analyst

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“…100 integrated tactile sensors were connected via a serial bus to verify operation in the system level. 5 The next stage is to extract information required for judgment and control from data acquired with a surface-distributed tactile sensor array. In this study, we considered the task of foreign matter detection in food, which is difficult to achieve with cameras, as an example to verify object judgment through machine learning using a tactile sensor array as the input.…”

Section: Introductionmentioning

confidence: 99%

“…In this device, the sensor platform LSI is packaged and integrated on the wafer level using MEMS technology. 100 integrated tactile sensors were connected via a serial bus to verify operation in the system level 5 . The next stage is to extract information required for judgment and control from data acquired with a surface‐distributed tactile sensor array.…”

Section: Introductionmentioning

confidence: 99%

Object judgment with an event‐driven MEMS‐LSI integrated tactile sensor array system

Muroyama,

Tanaka

2023

Elect Comm in Japan

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We have developed tactile sensor systems for next‐generation robots. To install a large number of tactile sensors, we have proposed micro electro mechanical systems‐large‐scale integration (MEMS‐LSI) integrated tactile sensors. The integrated device has the following features: capacitive type three‐axis force sensing, embedded diode‐based temperature sensing, signal processing for sensing data digitalization, and event‐driven response for efficient serial bus communication. This paper demonstrates a sensor array system as up‐to 40 integrated tactile sensors which are connected on one bus line. After acquiring the sensing data from the sensor array system, we applied a machine learning technique for target object judgment. The objective of the judgment is to classify the targets into normal object and abnormal object. With the sensor array system, data preprocessing and tuned Recurrent Neural network (RNN)/Long Short‐Term Memory (LSTM) neural network models, we achieved high‐accuracy, high‐precision, and high‐recall scores for the experiment of the judgment.

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Event-Driven Tactile Sensing System Including 100 CMOS-MEMS Integrated 3-Axis Force Sensors Based on Asynchronous Serial Bus Communication

Cited by 7 publications

References 30 publications

Micromechanical Force Sensor Using the Stress–Impedance Effect of Soft Magnetic FeCuNbSiB

Micromechanical Force Sensor Using the Stress–Impedance Effect of Soft Magnetic FeCuNbSiB

Recent advancements in physical and chemical MEMS sensors

Object judgment with an event‐driven MEMS‐LSI integrated tactile sensor array system

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