Direct integration of III-V semiconductor light sources on silicon is an essential step towards the development of portable, on-chip infrared sensor systems. Driven by the presence of characteristic molecular fingerprints in the mid-infrared spectral region, such systems may have a wide range of applications in infrared imaging, gas sensing and medical diagnostics. This paper reports on the integration of an InAs virtual substrate and high crystalline quality InAs/InAsSb multi-quantum wells on Si using a three-stage InAs/GaSb/Si buffer layer. It is shown that the InAs/GaSb interface demonstrates a strong dislocation filtering effect. A series of strained AlSb/InAs dislocation filter superlattices were also used, resulting in a low surface dislocation density of approximately 4 × 10 7 cm -2 . The InAs/InAsSb wells exhibited strong photoluminescence signal at elevated temperatures.Analysis of these results indicate that radiative recombination is the dominant recombination mechanism, making this structure promising for fabricating MIR Si-based sensor systems.The presence of fundamental vibration absorption bands of several gaseous species in the 2 to 12 μm mid-infrared (MIR) electromagnetic spectral region presents high technological potential for a wide range of applications, including absorption spectroscopy, environmental monitoring, chemical sensing and medical diagnostics. MIR silicon (Si) photonics has attracted great interest due to its potential to realize lab-on-chip optoelectronic systems. Si wafers have numerous advantageous properties, such as their large area, improved robustness and low cost. 1 Fabrication _____________________________