“…Besides, RTN can also cause reliability problems in other applications whose peripheral circuits are based on MOSFETs, such as the two-dimensional material-based applications [ 7 , 8 , 9 , 10 ]. Past research studying the mechanism of RTN on cryogenic bulk MOSFETs has already been presented, where primarily, the properties of RTN, such as time constants and trap depth, have been discussed [ 6 , 11 , 12 ]. However, the mechanism of RTN in the cryogenic fully depleted silicon-on-insulator (FDSOI) MOSFET, especially the relationship between the time constant, trap energy, and trap depth, is hardly mentioned in recent works.…”