We review current models and propose new approaches for the production of silicon thin films by low temperature plasma processes. Growth models have often been borrowed from those developed for hydrogenated amorphous silicon and are based on surface diffusion of SiH 3 . However, in situ growth studies have also pointed out the fast diffusion of hydrogen and its role in the crystallization of the film through subsurface reactions. Moreover, ions and silicon nanocrystals can also play a crucial role in microcrystalline silicon deposition. We show that ion bombardment is responsible for the formation of a disorderd subsurface layer while deposition on a cooled substrate allows us to trap the silicon nanocrystals and to prevent their growth, thus leading to nanocrystalline thin films. The deposition at 200 °C on substrates with a low density of surface defects allows for the surface mobility of the nanocrystals and their agglomeration to form large grains, thus resulting in polycrystalline silicon thin films.