Experimental determination and thermodynamic calculation of the phase equilibria and surface tension in the Sn-Ag-In system

Abstract

The phase equilibria of the Sn-Ag-In system were investigated by means of differential scanning calorimetry (DSC) and metallography. The isothermal sections at 180-600°C, as well as some vertical sections, were determined. Thermodynamic assessment of this system was also carried out based on the experimental data of thermodynamic properties and phase equilibria using the calculation of phase diagram (CALPHAD) method, in which the Gibbs energies of the liquid, fcc, and hcp phases are described by the subregular solution model, and those of compounds are represented by the sublattice model. The thermodynamic parameters for describing the phase equilibria were optimized, and reasonable agreement between the calculated and experimental results was obtained. The maximum bubble-pressure method and dilatometric method have been used in measurements of the surface tension and density of the binary In-Sn and ternary (Sn-3.8Ag) eut ϩ In (5 at.% and 10 at.% ) liquid alloys, respectively. The experiments were performed in the temperature range from 160-930°C. The experimental data of the surface tension were compared with those obtained by the thermodynamic calculation of Butler's model.

Effect of Cu Addition to Zn-12Al Alloy on Thermal Properties and Wettability on Cu and Al Substrates

“…pct Cu on a Cu substrate was the largest at 823 K (550°C). These tests also showed that the temperature affects of the formation and growth of some intermetallic phases, such as Cu 5 2 and Al approximately 300 mm 2 ). The melting point of Cu is higher than that of Al, which results in the formation of IMPs in the Cu-Zn system and the dissolution of Al in the Al-Zn system, as shown by the phase diagram.…”

“…The electrical and electronics industries have developed replacements using the addition of alloying elements to lead-free and tin-based soft solder that melts at 503 K (230°C). [1][2][3][4][5] However, the automotive and cooling industries have used solders with higher melting points. [6] Therefore, an important task is to develop new solders with appropriate wetting properties, melting points, mechanical strength, etc.…”

Surface Tension and Density Measurements of Sn-Ag-Sb Liquid Alloys and Phase Diagram Calculations of the Sn-Ag-Sb ternary system

“…Examples of such trends were published jointly in the case of Ag-In 1) and Sn-Ag-In 2) liquid alloys. The separate experimental studies 3) in Krakow on surface tension and density on binary low melting eutectics and on third additions to binary eutectics have shown that the comparison of the surface tension with the values calculated from optimized thermodynamic parameters is reliable.…”

Database of Pb - free soldering materials, surface tension and density, experiment vs. Modeling

“…Liu et al, 2001c); (Moser, Gąsior & Pstruś, 2001b); (Gąsior, Moser, & Pstruś, 2003a); (Moser, Gąsior, Ishida, Ohnuma, Liu, Bukat et al, 2005b); (Pamies, Garcia-Cordovilla & Louis, 1984) (Nogi, Oishi & Ogino, 1989); (Gąsior, Moser & Dębski, 2004c); (Liu, Inohana, Ohnuma, Kainuma, Ishida, Moseret al, 2002); (Gąsior, Moser, Pstruś, Krzyżak & Fitzner, 2003b); ; (Moser, Gąsior & Pstruś, 2005a); (Gąsior, Moser, Pstruś, Bukat, Kisiel & Sitek, 2004e); (Moser, Gąsior, Pstruś & Księżarek, 2002); (Moser, Gąsior, Pstruś, Ishihara, Liu, Ohnuma et al, 2004d); (Gąsior, Moser & Pstruś, 2004b); (Moser, Gąsior, Ishida, Ohnuma, Bukat, Pstruś et al, 2004c); (Gąsior, Moser, Bukat, Pstrus, Sitek, & Kisiel, 2004d); (Kisiel, Gąsior, Moser, Pstruś, Bukat & Sitek, 2005). (Gąsior et al, 2001) Pb -Sn (Gąsior et al, 2001) (Sn-Ag) eut +Zn * Sn (Moser et al, 2001a) Ag -Sn (Moser et al, 2001a) (Sn-Ag) eut +In (Liu et al, 2002) In (Moser et al, 2001c) Ag -In (Moser et al, 2001c) (Sn-Ag) eut +Bi (Moser et al, 2001b) Ag (Moser et al, 2001c) Bi -Sn ) (Moser et al, 2001b) (Sn-Ag) eut +Cu (Gąsior et al, 2004e) ) Bi (Moser et al, 2001b) In -Sn (Liu et al, 2002) (Sn-Ag) eut +Sb Sb (Gąsior et al, 2003a) Ag -Bi (Gąsior et al, 2003b) (Sn-Ag) eut +Cu+Sb (Moser et al, 2005a) Cu (Moser et al, 2005b) Sb -Sn (Gąsior et al, 2003a) (Sn-Ag) eut +Cu+Bi (Moser et al, 2005b) ) Zn * In -Zn Sn -Zn A...…”

“…This co-operation was next extended on phase diagram calculation (Moser et al, 2001c;Liu et al, 2002) and on simulation of solidification. The enclosed two schemes dealing with the ADAMIS and SURDAT data bases show the structures and the main functioning of both data bases Gąsior, Moser & Dębski, 2004a).…”