Exploring the nonlinear piezoresistive effect of 4H-SiC and developing MEMS pressure sensors for extreme environments

Wu, Chen; Fang, Xudong; Qiang, Kang; Fang, Ziyan; Wu, Junxia; He, Hongtao; Zhang, Dong; Zhao, Libo; Tian, Bian; Maeda, Ryutaro; Jiang, Zhuangde

doi:10.1038/s41378-023-00496-1

Cited by 26 publications

(5 citation statements)

References 56 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…When the number of failed sensors exceeds an acceptable level, the structural health monitoring (SHM) system may provide unreliable monitoring or predictions of structural performance. To avoid this situation, the current practice is to use high-cost sensors designed to withstand harsh environments in SHM systems [127][128][129], with a large amount of redundant sensor placements, resulting in a widespread application of costly and burdensome systems.…”

Section: Adverse Environmental Effectsmentioning

confidence: 99%

Wireless Sensor Placement Optimization for Bridge Health Monitoring: A Critical Review

Chen,

Shi,

et al. 2024

Buildings

View full text Add to dashboard Cite

In recent years, wireless sensors have progressively supplanted conventional limited sensors owing to their attributes of small size, low cost, and high accuracy. Consequently, there has been a growing interest in leveraging wireless sensor networks for bridge structural health monitoring applications. By employing wireless sensor nodes to gather data from various segments of the bridge, information is relayed to a signal-receiving base station. Subsequently, the health status of the bridge is inferred through specific data processing and analysis, aiding monitoring personnel in making informed decisions. Nonetheless, there are limitations in this research, particularly pertaining to power consumption and efficiency issues in data acquisition and transmission, as well as in determining the appropriate wireless sensor types and deployment locations for different bridge configurations. This study aims to comprehensively examine research on the utilization of wireless sensor networks in the realm of bridge structural health monitoring. Employing a systematic evaluation methodology, more than one hundred relevant papers were assessed, leading to the identification of prevalent sensing techniques, data methodologies, and modal evaluation protocols in current use within the field. The findings indicate a heightened focus among contemporary scholars on challenges arising during the data acquisition and transmission processes, along with the development of optimal deployment strategies for wireless sensor networks. In continuing, the corresponding technical challenges are provided to address these concerns.

show abstract

Section: Adverse Environmental Effectsmentioning

confidence: 99%

Wireless Sensor Placement Optimization for Bridge Health Monitoring: A Critical Review

Chen,

Shi,

et al. 2024

Buildings

View full text Add to dashboard Cite

show abstract

“…where s = a/b refers to the aspect ratio of the diaphragm, P is designated by the applied pressure, and flexural rigidity, D is represented by expression (11),…”

Section: B System Organization Of Pressure Sensormentioning

confidence: 99%

“…In high-temperature zones and dangerous environments like extraction of geothermal energy, gas turbines, drilling of deep wells and aero engines MEMS pressure sensors are very advantageous stated by Wu. et al [11]. Liu et al [12] highlighted the temperature characteristics of nano-films made of polysilicon using the technique of film configuration.…”

Section: Introductionmentioning

confidence: 99%

Improved Sensitivity of MEMS-based Piezoresistive Pressure Sensor using Silicon Nitride Diaphragm

Das,

Dutta

2024

JICS

View full text Add to dashboard Cite

In this paper, Piezoresistive Pressure Sensor (PPS) with four Polysilicon piezoresistors on Si3N4 diaphragm with improved sensitivity is successfully designed by using MEMS technology. Sensing is accomplished via deposited polysilicon resistors like metal resistors. The analytical model of PPS is optimized for location and geometry of the piezoresistors and the sensors based on different aspect ratios (both square and rectangular) have been investigated. The performance parameters like maximum deflection, maximum induced stress on the diaphragm have been compared using ANSYS and MATLAB simulation programming based on mathematical model. By interpreting the proper selection of the geometry of a thin Si3N4 diaphragm, the maximum deflection, maximum induced stress and highest sensitivity for this sensor are obtained for the diaphragm when aspect ratio is minimum. It has been found that sensitivity of the sensor is achieved when the piezoresistors are symmetrically placed at 65 m from the edges of the diaphragm. The analysis describes that the sensor based on square diaphragm is more sensitive than the rectangular one. It is influenced more powerfully by diaphragm thickness. The applied pressure range is considered from 0.5 kPa to 40 kPa. From the simulation results, the shape and the sensor design can be optimized for a highly sensitive PPS.

show abstract

“…In these cases, the same process is used, with the difference that the ion implantation of hydrogen at a controlled depth on the monolithic SiC substrate on which the epitaxial 4H or 6H SiC was grown is utilized to detach the SiC layer after wafer bonding and obtain the desired SiC/SiO 2 stack for the MEMS fabrication [ 156 ]. Using this method, or, in some cases, bulk micromachining techniques from SiC substrates, several MEMS applications have been addressed using 4H- and 6H-SiC, such as pressure sensors [ 157 ], thermal sensors [ 158 ], accelerometers [ 159 ], mechanical resonators [ 160 , 161 , 162 ], and gyroscopes [ 163 ].…”

Section: Sic Memsmentioning

confidence: 99%

Emerging SiC Applications beyond Power Electronic Devices

et al. 2023

View full text Add to dashboard Cite

In recent years, several new applications of SiC (both 4H and 3C polytypes) have been proposed in different papers. In this review, several of these emerging applications have been reported to show the development status, the main problems to be solved and the outlooks for these new devices. The use of SiC for high temperature applications in space, high temperature CMOS, high radiation hard detectors, new optical devices, high frequency MEMS, new devices with integrated 2D materials and biosensors have been extensively reviewed in this paper. The development of these new applications, at least for the 4H-SiC ones, has been favored by the strong improvement in SiC technology and in the material quality and price, due to the increasing market for power devices. However, at the same time, these new applications need the development of new processes and the improvement of material properties (high temperature packages, channel mobility and threshold voltage instability improvement, thick epitaxial layers, low defects, long carrier lifetime, low epitaxial doping). Instead, in the case of 3C-SiC applications, several new projects have developed material processes to obtain more performing MEMS, photonics and biomedical devices. Despite the good performance of these devices and the potential market, the further development of the material and of the specific processes and the lack of several SiC foundries for these applications are limiting further development in these fields.

show abstract

Exploring the nonlinear piezoresistive effect of 4H-SiC and developing MEMS pressure sensors for extreme environments

Cited by 26 publications

References 56 publications

Wireless Sensor Placement Optimization for Bridge Health Monitoring: A Critical Review

Wireless Sensor Placement Optimization for Bridge Health Monitoring: A Critical Review

Improved Sensitivity of MEMS-based Piezoresistive Pressure Sensor using Silicon Nitride Diaphragm

Emerging SiC Applications beyond Power Electronic Devices

Contact Info

Product

Resources

About