2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) 2015
DOI: 10.1109/therminic.2015.7389604
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Extension of SystemC with logi-thermal simulation capabilities

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Cited by 4 publications
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“…The main goals of this field are to determine (i) how to accurately estimate the geometric and dissipation characteristics of circuits based on such abstract models, (ii) how to make it possible for such different simulation domains (thermal and high level behavioral) to exchange information, and (iii) how to integrate the developed methods into the traditional design flow [34,47]. cepts not yet used today.…”
Section: Thermal-aware Design Of Complex Digital Icsmentioning
confidence: 99%
“…The main goals of this field are to determine (i) how to accurately estimate the geometric and dissipation characteristics of circuits based on such abstract models, (ii) how to make it possible for such different simulation domains (thermal and high level behavioral) to exchange information, and (iii) how to integrate the developed methods into the traditional design flow [34,47]. cepts not yet used today.…”
Section: Thermal-aware Design Of Complex Digital Icsmentioning
confidence: 99%