2001
DOI: 10.1007/s001070100219
|View full text |Cite
|
Sign up to set email alerts
|

Exterior OSB preparation technology at high moisture content - Part 1: Transfer mechanisms and pressing parameters

Abstract: In the case of panels bonded with adhesives capable to tolerate high to very high percentages M.C. (20%±24% MC) of the mat during pressing, the highest OSB core layer temperature will be reached at longer press closing times. This will result in better plasticization of the core layer. The press temperature will in¯uence the steam front transfer time to the core layer. Furthermore, contrary to the traditional lower moisture content bonding, it was possible to deduce the existence of capillary water and that su… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
8
0
4

Year Published

2005
2005
2016
2016

Publication Types

Select...
4
2
1

Relationship

1
6

Authors

Journals

citations
Cited by 18 publications
(12 citation statements)
references
References 11 publications
0
8
0
4
Order By: Relevance
“…A considerable advantage is the much higher moisture content of the resinated chips tolerable with these adhesives than with any of the synthetic phenolic and aminoresin counterparts. In the case of wood particleboard and of oriented strandboard (OSB) panels, the technology so developed allows hot-pressing at moisture contents of around 24 per cent, against values of 12 per cent for traditional synthetic adhesives, and presents other advantages as well [58,66,67] .…”
Section: Wood Adhesivesmentioning
confidence: 99%
“…A considerable advantage is the much higher moisture content of the resinated chips tolerable with these adhesives than with any of the synthetic phenolic and aminoresin counterparts. In the case of wood particleboard and of oriented strandboard (OSB) panels, the technology so developed allows hot-pressing at moisture contents of around 24 per cent, against values of 12 per cent for traditional synthetic adhesives, and presents other advantages as well [58,66,67] .…”
Section: Wood Adhesivesmentioning
confidence: 99%
“…Concluiu descrevendo que, entre as variáveis analisadas, o aumento da temperatura de prensagem se destacou por proporcionar redução do tempo de prensagem e melhora das propriedades físico-mecânicas. Pichelin et al (2001) e Calegari et al (2000 descreveram o perfil da temperatura de modo semelhante a Zombori (2001) e Bolton et al(1989). Pichelin et al (2001), entretanto, descreveram que, quando o colchão é prensado sob alto teor de umidade (20 a 24%), o perfil da temperatura tende a se comportar de maneira diferenciada de algumas fases descritas por Zombori (2001).…”
Section: ____________________________________________________unclassified
“…Pichelin et al (2001) e Calegari et al (2000 descreveram o perfil da temperatura de modo semelhante a Zombori (2001) e Bolton et al(1989). Pichelin et al (2001), entretanto, descreveram que, quando o colchão é prensado sob alto teor de umidade (20 a 24%), o perfil da temperatura tende a se comportar de maneira diferenciada de algumas fases descritas por Zombori (2001). Na segunda fase, não ocorre elevação linear da temperatura, mas, sim, um rápido aumento no início da fase e, posteriormente, um aumento muito mais gradativo.…”
Section: ____________________________________________________unclassified
See 2 more Smart Citations