“…Despite these characteristics, the application of IRAS to semiconductor process monitoring is severely limited, because when the adsorbate is on a semiconductor or an insulator surface, its sensitivity is low and the band shape is significantly distorted depending on the incident angle, the wavelength, and the anomalous dispersion of the adsorbate. To overcome these disadvantages, several authors have proposed the use of a buried-metal-layer (BML) substrate (Bermudez & Prokes, 1991;Ehrley, Butz & Mantl, 1991), which has a metal layer buried under a thin film of semiconductor or insulator material (buffer layer) that is thinner than the wavelength of the infrared radiation. Such a substrate exhibits the characteristics of the buffer layer for surface chemical reactions, while it behaves as a metal for the infrared radiation.…”