2010
DOI: 10.1002/sia.3376
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Extracting interdiffusion parameters from Ni/Cu thin films by means of profile reconstruction with the MRI model

Abstract: Thin film diffusion studies often involve a surface-sensitive analysis technique combined with ion erosion to produce a depth profile of a sample. Such studies compare the depth profile of a reference sample to the depth profiles of samples that were annealed at different temperatures and times. The extent to which atoms of one layer diffuse into an adjacent layer, for a particular temperature and time, yields information on the diffusion process involved and allows quantification of the diffusion coefficient.… Show more

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Cited by 4 publications
(2 citation statements)
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“…The experimental diffusion path length at 200 °C is ∼10 nm (Figure d), which is on the same scale as the predicted value of 4.541 nm assuming a crystallite size of 4.16 nm. Since the simulation and experiment are consistent, the mechanism of Cu/Ni diffusion can be hypothesized to be grain-boundary diffusion with surface-induced diffusion activation energy decrease. , The results show that combining quicker diffusion kinetics with a shorter diffusion path increases nanoscale diffusion, allowing Cu and Ni alloying at low temperatures.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The experimental diffusion path length at 200 °C is ∼10 nm (Figure d), which is on the same scale as the predicted value of 4.541 nm assuming a crystallite size of 4.16 nm. Since the simulation and experiment are consistent, the mechanism of Cu/Ni diffusion can be hypothesized to be grain-boundary diffusion with surface-induced diffusion activation energy decrease. , The results show that combining quicker diffusion kinetics with a shorter diffusion path increases nanoscale diffusion, allowing Cu and Ni alloying at low temperatures.…”
Section: Resultsmentioning
confidence: 99%
“…Since the simulation and experiment are consistent, the mechanism of Cu/Ni diffusion can be hypothesized to be grain-boundary diffusion with surface-induced diffusion activation energy decrease. 52, 53 The results show that combining quicker diffusion kinetics with a shorter diffusion path increases nanoscale diffusion, allowing Cu and Ni alloying at low temperatures.…”
Section: ■ Results and Discussionmentioning
confidence: 99%