“…On each substrate a set of three resistors of 200 m width and lengths of 30, 60, 90, 120, 150, and 300 m has been prepared. Successive stages of the resistor preparation process include (i) the firing of the substrate, (ii) screen-printing of the conductive layer on the fired substrate, (iii) laser scribing of the dried conductive layer to define the length of the resistor, (iv) firing of the conductive layer, (v) screen-printing of the resistive paste into the incised place, and finally (vi) firing of the resistive layer using a suitable temperature profile with 875 C peak firing temperature [23]. The thickness of the final resistive layers has been measured with the Talysurf CCI (from Taylor Hobson Precision) optical profilometer, giving d ≈ 15 m for the resistors of 30, 60, and 90 m length, and d ≈ 10 m for the others.…”