Fabrication and properties of integrated magnetic inductors using an RLC model which takes into account eddy current

Yaya, D.D.; Capraro, S.; Youssouf, K.; Youssouf, M.K.; Béchir, Mahamat Hassan; Chatelon, Jean-Pierre; Rousseau, Jean Jacques

doi:10.1007/s00542-016-2856-9

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2018

2024

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Cited by 6 publications

References 15 publications

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HR-Si TSV integrated inductor

Jin

2022

TSV 3D RF Integration

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HR-Si TSV integrated inductor

Jin

2022

TSV 3D RF Integration

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The simulation study of high-performance micro-inductors Based on MEMS 3D coils

Yi,

Pi,

Chen

et al. 2024

J. Phys.: Conf. Ser.

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With the development of flexible electronics and microsystems, the demand for the miniaturization of electronic components is becoming increasingly urgent. Due to the advantages of miniaturization, low power consumption, and easy integration, the micro-inductors fabricated by microfabrication technology get more and more attention. However, the traditional two-dimensional inductors are no longer able to meet the growing needs of today’s society in terms of occupied areas, inductance values, and packaging costs. So, this paper proposes a three-dimensional structure thin film solenoid micro-inductor based on MEMS and analyzes it by using finite element method (FEM). The simulation focuses on recording the inductance values and quality factors of the micro-inductors with varying parameters in the frequency range of 0-2, 000 MHz. Additionally, the maximum current values corresponding to the micro-inductors with different parameters are recorded at the operating temperature of polyimide, specifically addressing the current-carrying capacity. The simulation result has certain theoretical guidance for high-performance micro-inductors design.

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