“… 8,9 Usually, thermally conductive fillers, such as metals (Ag, 10,11 Cu, 12,13 Al 14,15 ), nitride (BN, 16–18 AlN, 19–21 Si 3 N 4 (ref. 22–24 )) and carbon materials (carbon nanotube, 25,26 carbon fiber, 27–30 graphene 31 ) are used to modify polymers for high thermal conductivity. However, it is difficult for particle fillers to achieve continuous thermal transport at low filler content, while the mechanical performance of polymer-based composite at high-filler loading will be changed and destroyed.…”