1993
DOI: 10.1364/ao.32.004916
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Fabrication of buried channel waveguides on silicon substrates using spin-on glass

Abstract: A new process for the deposition of thick (≈10-µm) films of silica and titania-doped silica on silicon substrates is described. Films are built up by repetitive operation of a simple process cycle in which a layer of sol-gel material is deposited by spin coating, then densified by rapid thermal annealing. Stressfree layers are obtained through careful choice of the anneal temperature. Bilayer structures suitable for waveguide fabrication may also be constructed by performing two successive deposition runs usin… Show more

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Cited by 75 publications
(55 citation statements)
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“…Next, the Yb-doped silica solgel is deposited in three layers onto a silicon substrate by spin coating. Immediately after each layer deposition, the thin film is annealed at 1,000°C in normal atmosphere for 3 h to remove the solvent, undesired organics, and hydroxyl groups in the solgel network [11,12]. Afterwards, the glass film is patterned by standard lithography and isolated silica disks are defined on the silicon substrate using a buffered oxide wet etch.…”
mentioning
confidence: 99%
“…Next, the Yb-doped silica solgel is deposited in three layers onto a silicon substrate by spin coating. Immediately after each layer deposition, the thin film is annealed at 1,000°C in normal atmosphere for 3 h to remove the solvent, undesired organics, and hydroxyl groups in the solgel network [11,12]. Afterwards, the glass film is patterned by standard lithography and isolated silica disks are defined on the silicon substrate using a buffered oxide wet etch.…”
mentioning
confidence: 99%
“…Further heat treatment is then needed to drive off remaining solvent, to remove residual organic groups, and to collapse the pores. A high degree of shrinkage is involved, and the resulting stress usually limits maximum film thickness; however, cracking can be prevented by an iterative process in which a number of thin layers are deposited and annealed [10]. Based on this approach, buried channel waveguides have been developed with low loss, and passive components such as splitters have been demonstrated [11].…”
Section: Formats For Edwasmentioning
confidence: 99%
“…These layers may then be formed into buried channel guides by reactive ion etching and burial [60], [61]. An alternative strip-loaded geometry with higher coupling and propagation loss has also been developed [62].…”
Section: Sol-gel Silica-on-siliconmentioning
confidence: 99%
“…Both these systems were based on TiO -SiO . However, TiO is relatively unsuitable, because of its high process temperatures [60] and tendency to form crystalline rutile or anatase phases [63].…”
Section: Sol-gel Silica-on-siliconmentioning
confidence: 99%