2004
DOI: 10.1016/j.carbon.2004.05.002
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Fabrication of carbon nanotube field effect transistors by AC dielectrophoresis method

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Cited by 137 publications
(120 citation statements)
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“…After the trapping process is complete, the chip is rinsed with IPA and blow dried with nitrogen gas to remove any unwanted nanotubes or impurities in the suspension. Other groups have dispersed CNT in an aqueous sodium dodecyl sulfate (SDS) [14][15][16][17][18][19][20]23], isopropyl alcohol (IPA) [21], dimethylformamide (DMF) [24], and DCE [25] for DEP assembly. Although an aqueous SDS solution has been used most frequently and has been shown to disperse CNT well, it is not compatible with our device fabrication process.…”
Section: Methodsmentioning
confidence: 99%
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“…After the trapping process is complete, the chip is rinsed with IPA and blow dried with nitrogen gas to remove any unwanted nanotubes or impurities in the suspension. Other groups have dispersed CNT in an aqueous sodium dodecyl sulfate (SDS) [14][15][16][17][18][19][20]23], isopropyl alcohol (IPA) [21], dimethylformamide (DMF) [24], and DCE [25] for DEP assembly. Although an aqueous SDS solution has been used most frequently and has been shown to disperse CNT well, it is not compatible with our device fabrication process.…”
Section: Methodsmentioning
confidence: 99%
“…In DEP, CNTs are assembled from solution using a non-uniform AC electric field. However, all DEP assembled CNT-FETs reported in the literature used only a global back gate [14][15][16][17][18][19][21][22]24]. Global back gated devices give poor device performance due to inefficient gate coupling and contact-controlled operation.…”
Section: Introductionmentioning
confidence: 99%
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“…In order that the biomaterials can well adsorb on the surface of the SWNTs, the devices were rinsed with deionized water and soaked in it for overnight to completely remove SDS residuals [28,29]. Selective electrical burnout [30] process was applied to remove metallic SWNTs and ensure a better electric contact between the semiconducting SWNTs and electrodes. From Figure 1a, one can see well aligned SWNT bundles bridging the electrode pairs.…”
Section: Methodsmentioning
confidence: 99%
“…1c inset) using AC dielectrophoresis technique [28 -30]. Electrical breakdown process [29] was employed to remove metallic SWNTs and improve the contacts between the SWNTs and electrodes. In order to remove the surfactant residuals on the SWNTs, the samples were soaked in deionized water for overnight [31].…”
Section: Methodsmentioning
confidence: 99%