Fabrication of Copper Damascene Patterns on Polyimide Using Direct Metallization on Trench Templates Generated by Imprint Lithography

Matsumura, Yasufumi; Enomóto, Yasushi; Tsuruoka, Takaaki; Akamatsu, Kensuke; Nawafune, Hidemi

doi:10.1021/la101350f

Cited by 15 publications

(7 citation statements)

References 38 publications

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“…It is certainly feasible to perform the electrochemical deposition at the full wafer level, but this was not attempted here because of the large wafer diameter. For example, Cu plating of full 200−300-mm-diameter wafers via the “Damascene” process is common in commercial semiconductor processing , , a procedure that is likely adaptable to molecular layer formation through diazonium reduction. As shown in Figure S1 in the Supporting Information, the e-carbon surface after all lithography steps but before diazonium reduction has a root-mean-square (rms) roughness of 0.42 nm, with the AFM image showing no observable defects.…”

Section: Resultsmentioning

confidence: 99%

Microfabrication and Integration of Diazonium-Based Aromatic Molecular Junctions

Szeto

Bonifas

et al. 2010

ACS Appl. Mater. Interfaces

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Microfabrication techniques common in commercial semiconductor manufacturing were used to produce carbon/nitroazobenzene/Cu/Au molecular junctions with a range of areas from 3×3 to 400×400 μm, starting with 100-mm-diameter silicon wafers. The approach exhibited high yield (90-100%) and excellent reproducibility of the current density (relative standard deviation of typically 15%) and 32 devices on a chip. Electron-beam-deposited carbon films are introduced as substrates and may be applied at the full wafer level before dicing and electrochemical deposition of the molecular layer. The current scaled with the device area over a factor of >600, and the current density was quantitatively consistent with structurally similar molecular junctions made by other techniques. The current densities were weakly dependent on temperature over the range of 100-390 K, and maximum current densities above 400 A/cm2 were observed without breakdown. To simulate processing and operation conditions, the junction stability was tested at elevated temperatures. The JV curves of microfabricated junctions were unchanged after 22 h at 100 °C. A ∼50% increase in the current density was observed after 20 h at 150 °C but then remained constant for an additional 24 h. Parallel fabrication, thermal stability, and high yield are required for practical applications of molecular electronics, and the reported results provide important steps toward integration of molecular electronic devices with commercial processes and devices.

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Section: Resultsmentioning

confidence: 99%

Microfabrication and Integration of Diazonium-Based Aromatic Molecular Junctions

Szeto

Bonifas

et al. 2010

ACS Appl. Mater. Interfaces

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“…The process involved the fabrication of trench‐like structures on flexible substrates using imprint lithography. Metal was deposited in the trench‐like patterns and this was followed by the removal of any superfluous metal film by chemical‐mechanical polishing . However, this process is expensive.…”

Section: Introductionmentioning

confidence: 99%

Extremely Flexible Transparent Conducting Electrodes for Organic Devices

Jung

Lee

Song

et al. 2013

Advanced Energy Materials

115

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their strong potential as replacements for ITO these materials suffer from the classic trade-off between optical transmittance and electrical conductivity. Thicker layers afford higher conductivity, but this increase comes at the expense of optical transmittance and vice versa. In addition, large-area organic devices built using fl exible transparent conducting electrodes based on these materials exhibit low efficiency, owing to the low conductivity of TCEs, in the absence of additional metal grids. [17][18][19][20][21][22] It is possible to improve the conductivity of TCEs by incorporating metal grids in the organic devices. These metal grids are either deposited by thermal evaporation using a shadow mask, [ 17,18 ] patterned by lithographic methods, [ 19,20 ] or printed. [ 21,22 ] In organic devices, however, there is a limit to how thick the metal grids deposited beneath the organic layer can be. Because the organic layer is extremely thin (typically a few hundred nanometers in thickness), there is the possibility of there being electrical short-circuiting between the metal grids and the top electrode. To prevent this, researchers have tried inserting an insulating layer between the metal grids and the organic layers. [ 19 ] However, this process increases the manufacturing cost. Electrical short circuiting due to the use of printed metal grids can be prevented by embedding the grids in a polymer substrate. [ 24,25 ] Recently, a damascene process was used to fabricate a metalembedding fl exible substrate (MEFS). The process involved the fabrication of trench-like structures on fl exible substrates using imprint lithography. Metal was deposited in the trench-like patterns and this was followed by the removal of any superfl uous metal fi lm by chemical-mechanical polishing. [ 23 ] However, this process is expensive.Here we report a universal method to overcome this trade-off by using a combination of metal-embedding architecture into plastic substrate and ultrathin transparent electrodes, leading to highly transparent (optical transmittance ≈93% at a wavelength of 550 nm), highly conducting (sheet resistance ≈13 Ω ٗ −1 ) and extremely fl exible (bending radius ≈200 μ m) electrodes with very smooth surface. These electrodes were used to fabricate fl exible organic devices that exhibited performances similar or superior to that of devices fabricated on glass substrate. In addition, these fabricated fl exible devices did not show degradation in their performance even after being folded with a radius of ≈200 μ m.Extremely fl exible transparent conducting electrodes are developed using a combination of metal-embedding architecture into plastic substrate and ultrathin transparent electrodes, which leads to highly transparent (optical transmittance ≈93% at a wavelength of 550 nm), highly conducting (sheet resistance ≈13 Ω ᮀ −1 ), and extremely fl exible (bending radius ≈ 200 μ m) electrodes. The electrodes are used to fabricate fl exible organic solar cells and organic light-emitting diodes that exhibit performance sim...

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“…We have also reported a chemical metallization strategy that utilizes soft lithography with postchemical mechanical polishing, which enables the fabrication of metal damascene patterns on the polyimide substrate. 32 The use of ion-doped precursors has triggered the development of a new concept in polymer metallization (e.g., metallic thin films can be embossed through the diffusion of metallic ions from the interior of a substrate, which is essentially different from conventional vacuum, electrochemical, and electroless metal deposition processes). By taking advantage of the ion-exchangeable nature of the precursors used for the generation of metal/ polymer heterostructures, we demonstrate in this study how it is possible to merge the direct metallization technique using iondoped precursors with electrochemical lithography to fabricate metal patterns on polyimide substrates.…”

Section: ' Introductionmentioning

confidence: 99%

“…A variety of direct deposition techniques have been introduced by several groups, including ours, on the basis of photoinduced chemistry, − thermal treatment, − and selective chemical reduction − for polyimides and other functional polymers. We have also reported a chemical metallization strategy that utilizes soft lithography with postchemical mechanical polishing, which enables the fabrication of metal damascene patterns on the polyimide substrate …”

Section: Introductionmentioning

confidence: 99%

Fabrication of Silver Patterns on Polyimide Films Based on Solid-Phase Electrochemical Constructive Lithography Using Ion-Exchangeable Precursor Layers

et al. 2011

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We report a fully additive-based electrochemical approach to the site-selective deposition of silver on a polyimide substrate. Using a cathode coated with ion-doped precursor polyimide layers, patterns of metal masks used as anodes were successfully reproduced at the cathode-precursor interface through electrochemical and ion-exchange reactions, which resulted in the generation of silver patterns on the polyimide films after subsequent annealing and removal from the substrate. Excellent interfacial adhesion was achieved through metal nanostructures consisting of interconnecting silver nanoparticles at the metal-polymer interface, which are electrochemically grown "in" the precursor layer. This approach is a resist- and etch-free process and thus provides an effective methodology toward lower-cost and high-throughput microfabrication.

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Fabrication of Copper Damascene Patterns on Polyimide Using Direct Metallization on Trench Templates Generated by Imprint Lithography

Cited by 15 publications

References 38 publications

Microfabrication and Integration of Diazonium-Based Aromatic Molecular Junctions

Microfabrication and Integration of Diazonium-Based Aromatic Molecular Junctions

Extremely Flexible Transparent Conducting Electrodes for Organic Devices

Fabrication of Silver Patterns on Polyimide Films Based on Solid-Phase Electrochemical Constructive Lithography Using Ion-Exchangeable Precursor Layers

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