“…The etch depth of these structures was chosen to be one of the standard etch levels available in the TU/e-SMART Photonics and OCLARO InP platforms [22], [23], thus not requiring any process adaptations for using the probes. The etching process provided by these platforms allows for high quality facets [20].…”
Section: Inp Counterpartmentioning
confidence: 99%
“…Edge-coupled devices have the advantage of broadband optical response, but access to the waveguide is not available until after the chips have been singulated from the wafer. Since the mode size of a standard single-mode fiber (SMF) and the waveguide may differ significantly (typically a factor [5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20], either mode-size converters are required or sub-micron alignment may be needed, or a combination of both. Grating couplers couple out-of-plane to a near-vertical direction and are manufacturable in thin membranetype high-contrast waveguides, typically in Si-based integration technologies.…”
Section: Introductionmentioning
confidence: 99%
“…Fundamental work developed by Vettiger et al [19] showed the potential of using etched facets for testing light-generating devices. Slanted mirrors in front of the etched facet have also been demonstrated to allow for vertical collection of the light propagating out of the waveguide [20]. However, extra processing steps are required and no method has been presented for passive alignment.…”
“…The etch depth of these structures was chosen to be one of the standard etch levels available in the TU/e-SMART Photonics and OCLARO InP platforms [22], [23], thus not requiring any process adaptations for using the probes. The etching process provided by these platforms allows for high quality facets [20].…”
Section: Inp Counterpartmentioning
confidence: 99%
“…Edge-coupled devices have the advantage of broadband optical response, but access to the waveguide is not available until after the chips have been singulated from the wafer. Since the mode size of a standard single-mode fiber (SMF) and the waveguide may differ significantly (typically a factor [5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20], either mode-size converters are required or sub-micron alignment may be needed, or a combination of both. Grating couplers couple out-of-plane to a near-vertical direction and are manufacturable in thin membranetype high-contrast waveguides, typically in Si-based integration technologies.…”
Section: Introductionmentioning
confidence: 99%
“…Fundamental work developed by Vettiger et al [19] showed the potential of using etched facets for testing light-generating devices. Slanted mirrors in front of the etched facet have also been demonstrated to allow for vertical collection of the light propagating out of the waveguide [20]. However, extra processing steps are required and no method has been presented for passive alignment.…”
“…However, the methods used have the drawback of process complexity and are not very well suited for large-scale wafer processing. A chemical etching technique was also recently explored for producing the reflective outcoupler in a InP/InGaAsP laser 17 , but the process is crystal facet-limited to produce a 55° angle, which limits the versatility of the technique. In addition, this approach is not easily adapted to the QCL waveguide, which has a more complex waveguide containing InP, GaInAs, and AlInAs.Figure 1Reflective outcoupler operation and formation.…”
A reflective outcoupler is demonstrated which can allow for stable surface emission from a quantum cascade laser and has potential for cost-effective wafer-scale manufacturing. This outcoupler is integrated with an amplified, electrically tunable laser architecture to demonstrate high power surface emission at a wavelength near 4.9 μm. Single mode peak power up to 6.7 W is demonstrated with >6 W available over a 90 cm−1 (215 nm) spectral range. A high quality output beam is realized with a simple, single-layer, anti-reflective coating. The beam shape and profile are shown to be independent of wavelength.
“…For these reasons, a GC is not suited for InP-based broadband devices such as tunable laser diodes. In terms of wavelength/temperatureindependent optical I/O, mirror-based OPCs are superior to diffractionbased ones [6,7]. However, problems with InP-based mirror couplers include batch-to-batch fabrication variation in the mirror angle and larger insertion loss than that of SiPh-based GCs.…”
The authors developed a mirror‐based out‐of‐plane optical coupler (MOOC) for InP photonic integrated circuits (PICs). The coupler has the coupling loss and alignment tolerance comparable to those of a conventional edge coupler. An asymmetric Mach–Zehnder interferometer (a‐MZI) with the MOOC exhibits little wavelength‐dependent loss (WDL) and a high extinction ratio (ER) of >20 dB over 100‐nm wavelength bandwidth. In addition, the temperature‐independent transmittance spectra were obtained. Finally, the authors fabricated a 4‐ch MOOC array with the pitch of 40 μm, which corresponds to the core pitch of practical multi‐core fibre (MCF).
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