Fabrication of high performance copper-resin lapping plate for sapphire: A combined 2-body and 3-body diamond abrasive wear on sapphire

Pyun, Hae-Jung; Purushothaman, M.; Cho, Byoung-Jun; Lee, Jung-Hwan; Park, Jin-Goo

doi:10.1016/j.triboint.2017.12.037

Cited by 16 publications

(9 citation statements)

References 19 publications

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“…Slurry-based loose abrasive lapping is a typical process of the three-body abrasion mode, and it is usually considered as a lower-efficiency process to remove material than two-body abrasion lapping. According to Rabinowicz et al [13], the abrasive grains in three-body abrasion spend 90% of their working time rolling and performing low material removal rate, that can be ten times higher in two-body abrasion [5]. In our ultraviolet-curable resin bond lapping plate, the diamond grains were uniformly distributed and fixed within the tool.…”

Section: Resultsmentioning

confidence: 89%

“…Therefore, the reaction completion and process parameter control could potentially limit the application of this technology. Based on the conventional thermal press and sintering process, Pyun et al [5] fabricated a high-performance copper-resin plate for sapphire machining to combine the two-body and three-body abrasion mode, and examined the influence of different amounts of curing agent as a function of resin weight. The interface between the Cu and resin and the hardness of the lapping plate were found to be the primary factor affecting the material removal, and thereby caused the temporary two-body abrasive transformed to three-body abrasive.…”

Section: Introductionmentioning

confidence: 99%

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An Experimental Study on the Precision Abrasive Machining Process of Hard and Brittle Materials with Ultraviolet-Resin Bond Diamond Abrasive Tools

et al. 2019

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Ultraviolet-curable resin was introduced as a bonding agent into the fabrication process of precision abrasive machining tools in this study, aiming to deliver a rapid, flexible, economical, and environment-friendly additive manufacturing process to replace the hot press and sintering process with thermal-curable resin. A laboratory manufacturing process was established to develop an ultraviolet-curable resin bond diamond lapping plate, the machining performance of which on the ceramic workpiece was examined through a series of comparative experiments with slurry-based iron plate lapping. The machined surface roughness and weight loss of the workpieces were periodically recorded to evaluate the surface finish quality and the material removal rate. The promising results in terms of a 12% improvement in surface roughness and 25% reduction in material removal rate were obtained from the ultraviolet-curable resin plate-involved lapping process. A summarized hypothesis was drawn to describe the dynamically-balanced state of the hybrid precision abrasive machining process integrated both the two-body and three-body abrasion mode.

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Section: Resultsmentioning

confidence: 89%

Section: Introductionmentioning

confidence: 99%

An Experimental Study on the Precision Abrasive Machining Process of Hard and Brittle Materials with Ultraviolet-Resin Bond Diamond Abrasive Tools

et al. 2019

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“…Therefore, the reaction completion and process parameter control could potentially limit the application of this technology. Pyun et al [12] fabricated a high-performance copper-resin plate for sapphire machining to combine the 2-body and 3-body abrasion mode, and examined the influence of different amounts of curing agent as a function of resin weight. The interface between the Cu and resin and the hardness of the lapping plate were found to be the primary factor affecting the material removal and thereby caused the temporary 2-body abrasive transformed into 3-body abrasive.…”

Section: B Machining Tool Fabricationmentioning

confidence: 99%

“…Based on the investigations from the previous researches discussed above, a conclusion could be drawn that all the attempts in integrating the 2-body and 3-body abrasion mode into one machining process, is established on the recognition of their advantages in the superior surface finishing capacity while retaining moderate material removal efficiency [12], [13]. Therefore, the development of the new manufacturing process to fabricate machining tools delivering the unique machining performance has been extensively researched recently and became one of the objectives in this study.…”

Section: B Machining Tool Fabricationmentioning

confidence: 99%

An Experimental Study on the Abrasive Machining Process of Electronic Substrate Material With A Novel Ultraviolet-Curable Resin Bond Diamond Lapping Plate

et al. 2019

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Sapphire is one of the most widely used electronic substrate materials in the industry. The manufacturing process of sapphire and such hard and brittle materials is extremely time and energy consuming because of their superior material properties in physical and chemical behaviors. In this study, the ultraviolet-curable resin is introduced into the fabrication of the diamond abrasive lapping plate as a bonding agent. A practical manufacturing process is established in the laboratory to develop an ultraviolet-curable resin bond fixed abrasive lapping plate for the precision machining of sapphire substrates, the machining performance of which is examined through a series of comparative experiments among the conventional fixed-abrasive lapping, the slurry-based lapping and this originally developed plate involved lapping. The surface topography and surface roughness of the machined sapphire workpieces are measured to evaluate the surface quality, and the weight loss of the workpieces in each machining process is recorded to estimate the respective machining efficiency. The promising results achieved from the ultraviolet-curable resin plate lapping process, in terms of a relatively higher material removal rate and better surface quality, indicate that the occurrence of a corporate action integrating both the advantages of the fixed abrasive grains and loose abrasive grains. A summarized hypothesis is drawn to describe the dynamically balanced state of the hybrid precision abrasive machining process, in which the 2-body abrasion and 3-body abrasion material removal mechanism participate simultaneously and interconvert to each other continuously. INDEX TERMS Material processing, sapphire substrate, tool manufacturing. I. INTRODUCTION A. MATERIAL AND MACHINING PROCESS Sapphire is the single crystal form of the compound Al 2 O 3 (α-alumina), and it is the second hardest natural material after diamond. As one of the most recognized highquality opto-mechatronic materials in the industry, it has been used broadly in various fields covering consumer electronics and military equipment. For instance, because of the superior material properties in physical strength, hardness, and The associate editor coordinating the review of this manuscript and approving it for publication was Bora Onat. high-temperature resistance, sapphire possesses the capability to endure the severe conditions of GaN film deposition, and which make sapphire became the predominate substrate material for light emitting diode (LED) applications [1]-[3]. Moreover, sapphire is also a wide gap (up to 0.9 eV) insulator presenting multiple favorable properties including the refractory behavior and transparency over a wide wavelength range, which enables sapphire to be employed as the laser diodes, optical materials or even insulator in a nuclear reactor [4], [5]. The machining process of sapphire substrate usually starts from the sawing of a sapphire cylinder bar of 50mm to 150mm in diameter, and following a sequence of precision

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“…Currently, the work in this area concerns, among other things, the use of non-standard tools containing metallic fiber fillers [ 21 , 22 , 23 ]. Another example is the development of abrasive tools based on resin and diamond abrasives, which are used in lapping processes without using a standard abrasive slurry—slurry-free lapping [ 24 , 25 ]. In this type of lapping process, abrasive particles can be directly applied to a flat surface of the tool, similar to grinding.…”

Section: Introductionmentioning

confidence: 99%

Applications of Additively Manufactured Tools in Abrasive Machining—A Literature Review

et al. 2021

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High requirements imposed by the competitive industrial environment determine the development directions of applied manufacturing methods. 3D printing technology, also known as additive manufacturing (AM), currently being one of the most dynamically developing production methods, is increasingly used in many different areas of industry. Nowadays, apart from the possibility of making prototypes of future products, AM is also used to produce fully functional machine parts, which is known as Rapid Manufacturing and also Rapid Tooling. Rapid Manufacturing refers to the ability of the software automation to rapidly accelerate the manufacturing process, while Rapid Tooling means that a tool is involved in order to accelerate the process. Abrasive processes are widely used in many industries, especially for machining hard and brittle materials such as advanced ceramics. This paper presents a review on advances and trends in contemporary abrasive machining related to the application of innovative 3D printed abrasive tools. Examples of abrasive tools made with the use of currently leading AM methods and their impact on the obtained machining results were indicated. The analyzed research works indicate the great potential and usefulness of the new constructions of the abrasive tools made by incremental technologies. Furthermore, the potential and limitations of currently used 3D printed abrasive tools, as well as the directions of their further development are indicated.

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Fabrication of high performance copper-resin lapping plate for sapphire: A combined 2-body and 3-body diamond abrasive wear on sapphire

Cited by 16 publications

References 19 publications

An Experimental Study on the Precision Abrasive Machining Process of Hard and Brittle Materials with Ultraviolet-Resin Bond Diamond Abrasive Tools

An Experimental Study on the Precision Abrasive Machining Process of Hard and Brittle Materials with Ultraviolet-Resin Bond Diamond Abrasive Tools

An Experimental Study on the Abrasive Machining Process of Electronic Substrate Material With A Novel Ultraviolet-Curable Resin Bond Diamond Lapping Plate

Applications of Additively Manufactured Tools in Abrasive Machining—A Literature Review

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