2004
DOI: 10.1016/j.sna.2004.03.055
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Fabrication of miniaturized fluidic devices using SU-8 based lithography and low temperature wafer bonding

Abstract: In this paper, we present a technology for the batch-fabrication of fluidic devices which combines polymer and metal layers. The structures are fabricated by means of two-layer lithography and SU-8-based wafer bonding technique. The combination of SU-8 and metal layers allows the fabrication of "2(1/2)"-dimensional fluidic structures. We realized different types of micromixers for the investigation of chemical reactions by time resolved FTIR-spectroscopy, a flow-through-cell for IR-detection in capillary elect… Show more

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Cited by 74 publications
(46 citation statements)
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“…After the final step (hard bake at 150°C for 45 min) the material is completely cross-linked achieving its chemical stability and mechanical strength. More details on the fabrication procedure can be found in Svasek et al (2004). PDMS cover lids (15 9 15 mm 2 , thickness = 0.5 mm) were used as a waterproof gasket sheet on top of the microfluidic chip.…”
Section: Channel Design and Fabricationmentioning
confidence: 99%
“…After the final step (hard bake at 150°C for 45 min) the material is completely cross-linked achieving its chemical stability and mechanical strength. More details on the fabrication procedure can be found in Svasek et al (2004). PDMS cover lids (15 9 15 mm 2 , thickness = 0.5 mm) were used as a waterproof gasket sheet on top of the microfluidic chip.…”
Section: Channel Design and Fabricationmentioning
confidence: 99%
“…Three microfluidic channels were fabricated from SU-8 in between the CaF 2 wafers using a fabrication procedure as found in. 13 The height of the channels was 23 lm and the channel volume was approximately 0.2 ll. A photograph of the device is shown in Fig.…”
Section: B Microfluidic Devicementioning
confidence: 99%
“…An open channel network is patterned on a substrate and then subsequently bonded onto a second substrate to form sealed cavities. This technique has been transferred to poly(dimethyl-siloxane) (PDMS), 5 poly-methyl-methacrylate (PMMA), 6,7 cyclic olefin copolymer (COC), 8 and SU-8 [9][10][11][12] photoresist. Complex multilevel fluidic devices in SU-8 12 and PDMS [13][14][15][16] have been achieved with the sequential stacking and bonding of multiple layers.…”
Section: Introductionmentioning
confidence: 99%